Display device having seal member being directly connected to junction portions

ABSTRACT

A method of manufacturing a liquid crystal device having a first substrate and a second substrate facing each other with a liquid crystal layer interposed therebetween, and a sealing member formed in a peripheral portion of at least one of the substrates. The method includes forming the sealing member, disposing the liquid crystal layer inside the sealing member, and bonding the first substrate to the second substrate. In forming the sealing member, a ring-shaped portion that seals the liquid crystal layer inside the sealing member, a first sealing layer and a second sealing layer that face each other to be separated from each other are formed. In the bonding of the first substrate to the second substrate, a junction portion is formed in which the first and second sealing layers are pressed and joined outside the sealing member so as to form the ring-shaped portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation patent application of U.S. application Ser. No.15/254,479 filed Sep. 1, 2016, which is a continuation patentapplication of U.S. application Ser. No. 14/571,729 filed Dec. 16, 2014,now U.S. Pat. No. 9,459,498, issued Oct. 4, 2016, which is a divisionalpatent application of U.S. application Ser. No. 11/301,086 filed Dec.12, 2005, now U.S. Pat. No. 9,599,861, issued Mar. 21, 2017, whichclaims priority to Japanese Patent Application No. 2004-375697 filedDec. 27, 2004. All the above applications are hereby expresslyincorporated by reference in their entireties.

BACKGROUND 1. Technical Field

The present invention relates to a method of manufacturing a liquidcrystal device, to a liquid crystal device, and an electronic apparatus.

2. Related Art

In an electronic apparatus, such as a cellular phone or the like, anelectro-optical device, such as a liquid crystal device or the like, isused as a color image display unit. The liquid crystal device has a pairof substrates with a liquid crystal layer interposed therebetween. Inorder to form the liquid crystal device, first, a sealant (sealingmaterial) is coated in a peripheral portion of a surface of onesubstrate. At that time, a liquid crystal injection hole is formed at apart of the sealant. Next, spacers are sprayed inside the sealant, andthen the other substrate is bonded to the one substrate via the sealant.Accordingly, a liquid crystal cell is formed in a region defined by thepair of substrates and the sealant. Next, the liquid crystal cell issubjected to a vacuum for de-aerating and is then brought back to anatmospheric pressure while the liquid crystal injection hole is dippedinto a liquid crystal vessel. In doing so, the liquid crystal cell isfilled with liquid crystal by means of a pressure difference between theinside and outside of the liquid crystal cell and surface tension. Whenliquid crystal is filled in such a manner, however, the liquid crystalinjection process takes an extremely long time. In particular, when alarge substrate whose diagonal is more than one meter is used, it takesmore than one day to entirely fill the substrate with liquid crystal.

Therefore, a dropping assembly method has been suggested in which liquidcrystal is dropped onto one substrate in which a frame-shaped sealant isprovided with no liquid crystal injection hole, and the other substrateis then bonded to the one substrate. According to this method, first, asealant formed of thermosetting resin or the like is coated in aperipheral portion of a surface of one substrate. Next, a predeterminedamount of liquid crystal is dropped onto the one substrate by a liquiddroplet ejection device. Finally, the other substrate is bonded to thesealant under a vacuum atmosphere, the vacuum atmosphere is released toan air pressure atmosphere, and then the sealant is subjected toultraviolet irradiation or heat treatment, thereby forming the liquidcrystal device. For this reason, unlike the related art liquid crystalinjection method, the sealant is formed in a ring shape with noinjection hole.

According to this method, after both substrates have been bonded, thevacuum atmosphere is released to atmospheric pressure. Accordingly, apredetermined cell gap to which a uniform pressure is applied from bothsubstrates can be obtained. Further, the cell gap can be determinedaccording to the amount of liquid crystal dropped. For example, if thedropping amount is excessively small, the cell gap is thin, and thus airbubbles tend to occur. Further, if the dropping amount is excessivelylarge, the cell gap is thick, and unevenness of the cell gap tends tooccur. Therefore, by setting the desired optimum dropping amount ofliquid crystal, a uniform cell gap can be obtained. Further, accordingto this method, unlike the related art liquid crystal injection method,the amount of liquid crystal used can be reduced, and theinjection/sealing process can be omitted, such that tact time can bereduced.

In addition, as a method of forming the sealant, a method has beensuggested in which a dispenser is used. See, for example,JP-A-2002-98979, JP-A-2003-222883, and JP-A-2003-241204, which arereferred to as Patent Documents 1, 2, and 3, respectively. This methodis a method in which, while relatively moving the dispenser and thesubstrate, the sealant is ejected onto the substrate in a predeterminedpattern. Here, at a part of a peripheral portion of the sealant, thepreviously ejected sealant and the subsequently ejected sealant overlapeach other, such that the sealant ejected on the substrate is formed ina ring shape. Accordingly, when the substrates are bonded after liquidcrystal is dropped, the liquid crystal can be suppressed from leakingoutside the ring-shaped pattern of the sealant.

The inventors have founded that, in the liquid crystal devices describedin the above-described Patent Documents, it is difficult to stably formthe sealant, a dummy space needs to be provided with respect to anadjacent panel, and the dispenser needs to be controlled at thebeginning and end of drawing in order to form one pattern by one drawingoperation. In addition, the inventors have founded that, in the methodof forming the sealant by use of the dispenser, in general, a defectivecell gap tends to occur.

As for an ejection method of a sealant by use of a dispenser, theinventors have found the following.

In such an ejection method, as shown in FIGS. 48A and 48B, the size of adrawing start portion 500 or a drawing end portion 510 needs to beformed to have the same size as those of other parts. This is because,when the size is excessively large, the cell gap is thickened, such thatdisplay unevenness occurs, and, when the cell gap is minute, liquidcrystal may leak from that portion, such that reliability is degraded.When the sealant is drawn by a dispenser, in general, as shown in FIGS.48A and 48B, at the drawing start portion 500 and the drawing endportion 510, the seal tends to be thickened or minuteness tends tooccur. In addition, there are many cases in which, in order to make thesize of a junction portion 520 uniform, the drawing start portion 500and the drawing end portion 510 overlap each other, as shown in FIG.48C. In this case, it has been confirmed that the length of the overlapportion is about 4 mm, and the width W2 of that portion is made largerthan a predetermined target width W1 by about 0.1 to 0.2 mm(ΔW=W2−W1=0.1 to 0.2 mm) due to the variation in viscosity of thesealant or the like.

Further, in a TFD (Thin Film Diode) driving-type liquid crystal deviceor a liquid crystal device in which STN (Super Twisted Nematic) liquidcrystal operates in a passive driving method, as shown in FIGS. 49 and50, relay wiring lines 601 formed on a surface of a circuit board havingdriver ICs 600 and 610 and a common electrode (hereinafter, referred toas COM electrode) 602 formed on a counter substrate need to beelectrically connected to each other via a conductive pad 603. In thiscase, conductive particles, in which the surface of a spacer issubjected to a plating treatment, are dispersed in the sealant, and thesealant is disposed on the conductive pad 603. As a result, the relaywiring lines 601 and the COM electrode 602 are electrically connected toeach other via the conductive particles, and then an output potential ofthe driver IC 600 is applied to a wiring line of the counter substrate.

On the other hand, segment electrodes (hereinafter, referred to as SEGelectrode) 604 relayed from the driver IC 610 up to a display area 620or the relay wiring lines 601 relayed from the driver IC 600 up to theconductive pad 603 need to cross the sealant. In this case, as for therelay wiring lines 601 and the SEG electrodes 604, in order to preventthe individual electrodes from being electrically shorted, a sealant,which does not contain the conductive particles, is configured to crossthe relay wiring lines 601 and the SEG electrodes 604.

By the way, as described above, when the sealant containing theconductive particles and the non-conductive sealant are used, from oneend (A of FIG. 50) of the conductive pad 603 up to an end portion (B ofFIG. 50) of the relay wiring line 601 crossing the sealant, bothsealants need to be connected to each other. In the TFD liquid crystaldevice or the STN liquid crystal device, there are many cases in whichthe distance L between the end A of the conductive pad 603 and the endportion of the relay wiring line 601 crossing the sealant is set to beequal to or less than 2 mm. For this reason, if the distance L is simplymade shorter than the length of the overlap portion shown in FIG. 48C,that is, 4 mm, it has been confirmed that, as shown in FIG. 48D, thelength of the overlap portion of the junction portion 520 becomes 1 mm,the width W3 is made thicker than the predetermined target width W1 byabout 0.5 to 0.6 mm (ΔW=W3−W1=0.5 to 0.6 mm), and thus a defective cellgap easily occurs.

Further, in Patent Document 1, the width of the overlap portion ofbeginning and termination for forming a seal line is set to be 0.4 to0.6 times as small as the seal line width. In this method, however, thecontrol of the dispenser is very complex, it takes a long time fordrawing, the seal shape tends to be varied due to a variation in theamount of a residual sealant in the dispenser or a variation inviscosity between different lots of the sealant, and management is verydifficult.

Further, in Patent Document 2, drawing starts from any portion outsidethe closed loop-shaped sealing member, and ends at a place outside theclosed loop-shaped sealing member which is different from the portionwhere drawing starts. In this method, however, there is a problem inthat a dummy space needs to be provided with respect to an adjacentpanel. In addition, in any of the methods of Patent Documents 1 to 3,one member is formed by one drawing operation. Accordingly, there is aproblem in that it takes time for the control of the dispenser at thebeginning and end of drawing, and the tact extends.

Therefore, the inventors have accomplished the aspects of the inventionon the basis of the above description.

An advantage of some aspects of the invention is that it provides amethod of manufacturing a liquid crystal device which can realize auniform cell gap, a liquid crystal device, and an electronic apparatus.

SUMMARY

According to a first aspect of the invention, there is provided a methodof manufacturing a liquid crystal device having a first substrate and asecond substrate facing each other with a liquid crystal layerinterposed therebetween, and a sealing member formed in a peripheralportion of at least one of the substrates. The method of manufacturing aliquid crystal device includes forming the sealing member, forming theliquid crystal layer inside the sealing member, and bonding the firstsubstrate to the second substrate. In the forming of the sealing member,a ring-shaped portion that seals the liquid crystal layer inside thesealing member, and a first sealing layer and a second sealing layerthat face each other to be separated from each other are formed. In thebonding of the first substrate to the second substrate, a junctionportion in which the first and second sealing layers are pressed and arejoined outside the sealing member so as to form the ring-shaped portionis formed.

Here, the first sealing layer and the second sealing layer are partswhich are formed by forming the sealing member and become the junctionportion by bonding the first substrate to the second substrate. That is,the first sealing layer and the second sealing layer constitute aprevious shape of the junction portion.

The junction portion joins sealing materials formed on the substrates toeach other and blocks the ring-shaped portion in order to prevent theliquid crystal layer inside the ring-shaped portion from leaking to theoutside. Further, the junction portion includes a state in which thesealing materials are joined while overlapping in a vertical directionof the substrates or a state in which the sealing materials are joinedwhile being close to each other in a horizontal direction of thesubstrates. Further, since a part of the junction portion is formedoutside of the ring-shaped portion, the junction portion is formedtoward the outside of the ring-shaped from a portion joining thering-shaped portion. Therefore, the entire junction portion is notformed to overlap the ring-shaped portion. That is, only part of thejunction portion is joined to the ring-shaped portion and other partsare formed toward the outside of the ring-shaped portion.

Further, in the forming of the sealing member, an ejection method isused in which the sealing material is ejected from nozzles of adispenser while the dispenser filled with the sealing material and thefirst substrate or the second substrate are relatively moved.

If doing so, since the ring-shaped portion is blocked by the part of thejunction portion, leakage of the liquid crystal layer from the junctionportion can be suppressed, and reliability of the liquid crystal devicecan be enhanced. Further, since the junction portion is formed towardthe outside of the ring-shaped portion, when the bonding of the firstsubstrate to the second substrate is performed, the width of thejunction portion is increased only outside the ring-shaped portion, andthus the sealing member can be suppressed from protruding inside thering-shaped portion. Further, there is no case in which a cell gapinside the ring-shaped portion is influenced, and thus the cell gap canbe uniformly maintained. Specifically, when a seal protrudes inside thering-shaped portion, for example, the seal may run onto color filters ina display region of the liquid crystal device, and thus the cell gap iseasily influenced. In contrast, in the invention, the sealing member isformed outside the ring-shaped portion, that is, in a region where thecolor filters are not formed, and thus there is no case in which theseal runs onto the color filters. Therefore, the cell gap can beuniformly maintained.

Further, as compared with the related art, the width of each member ofthe ring-shaped portion and the junction portion does not need to beadjusted, and the ring-shaped portion and the junction portion can beformed with a member having the same width, such that the sealing membercan be easily formed. Therefore, the dispenser can be easily controlled,and drawing of the sealing member can end in short time. Further, avariation of the amount of the sealing material remaining in thedispenser or a variation in viscosity between lots of the sealingmaterial does not need to be regarded as questionable, and the shape ofthe sealing member can be easily managed.

Further, according to a second aspect of the invention, in the method ofmanufacturing a liquid crystal device according to the first aspect ofthe invention, it is preferable that, in the forming of the sealingmember, a first side of the ring-shaped portion be formed on a straightline along which the sealing member extends, the first sealing layer beformed so as to be continuous with respect to the first side on acentral line different from an axis along which the first side extends,and the second sealing layer be formed to face the first sealing layer.

Here, ‘the first sealing layer is formed so as to be continuous withrespect to the first side on the central line different from the axisalong which the first side extends’ means that the first sealing layerand the first side are not formed on the same straight line, but arecontinuously formed. That is, since the first sealing layer and thefirst side are not formed on the same straight line, the first sealinglayer and the first side are formed via a curve or curved portion.Further, since ‘the first sealing layer is formed on the central linedifferent from the axis along which the first side extends’, the firstsealing layer may be formed on a curved central line or the firstsealing layer may be formed on an inclined central line to be inclinedwith respect to the axis along which the first side extends. As long asthe first sealing layer is formed on the corresponding central line,various modes can be adopted.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the first side of thering-shaped portion can be formed on the straight line along which thesealing member extends, and the first sealing layer can be formed so asto be continuous with respect to the first side. Further, the first sidecan be formed on the central line different from the axis along whichthe first side extends. Further, the second sealing layer can be formedto face the first sealing layer.

Further, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable that,when a line width of the sealing member in the ring-shaped portion afterthe bonding of the first substrate to the second substrate is performedis w2, and a distance between the central line of the first sealinglayer and the central line of the second sealing layer is d2, thefollowing relationship be established. Equation 1

0≦d2≦0.8×w2

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, even when a variationof the size of the sealing member occurs, the first sealing layer andthe second sealing layer can be reliably joined to form the junctionportion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable that,in the forming of the sealing member, in an axis direction perpendicularto an axis direction of the first side of the ring-shaped portion, asecond side be formed, and the second sealing layer be formed so as tobe continuous with respect to the second side via a curved portion.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the second sealinglayer, which is connected to the second side via the curved portion, andthe first sealing layer can be joined, thereby reliably forming thejunction portion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable that,when the radius of the curved portion is R2, the following relationshipbe established.

(R2/w2)≦−1.2×(d2/w2)+2.0  Equation 2

In addition, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable thatthe following relationship be established.

(R2/w2)≦−(d2/w2)+1.2  Equation 3

(R2/w2)≧−0.6×(d2/w2)+0.4  Equation 4

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained, and leakage of the liquid crystallayer from the ring-shaped portion can be prevented, regardless of thesize of the sealing member.

Further, in the method according to the related art, the sealing memberin the junction portion may be thickened, and the distance of theoverlap portion needs to be increased in order to control thickening tothe minimum. Further, the control of the device may be complicated, andthen it will take a long time for drawing the sealing member. Incontrast, in the method of manufacturing a liquid crystal deviceaccording to the first aspect of the invention, the sealing member canbe drawn at the same speed all over. Further, since a writing startportion or a writing end portion is sufficiently separated from theliquid crystal device, a complex control can be eliminated. Accordingly,drawing time can be markedly reduced to half to one-third of drawingtime in the related art. In addition, thickening of the sealing membertoward the inside of the liquid crystal device in the junction portionof the sealing member can be solved.

Further, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable that,in the forming of the sealing member, in an axis direction perpendicularto an axis direction of the first side of the ring-shaped portion, asecond side be formed, and the second sealing layer be formed so as tobe continuous with respect to the second side via an inclined portion.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the second sealinglayer, which is connected to the second side via the inclined portion,and the first sealing layer are joined, thereby reliably forming thejunction portion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable that,when a chamfered amount of the inclined portion is c2, the followingrelationship be established.

(c2/w2)≦−0.5×(d2/w2)+1.2  Equation 5

In addition, in the method of manufacturing a liquid crystal deviceaccording to the second aspect of the invention, it is preferable thatthe following relationship be established.

(c2/w2)≦−0.5×(d2/w2)+0.7  Equation 6

(c2/w2)≧−0.5×(d2/w2)+0.3  Equation 7

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, leakage of the liquidcrystal layer from the ring-shaped portion can be prevented, regardlessof the size of the sealing member.

Further, the sealing member can be drawn at the same speed all over.Further, since a writing start portion or a writing end portion issufficiently separated from the liquid crystal device, a complex controlcan be eliminated. Accordingly, drawing time can be markedly reduced tohalf to one-third of drawing time in the related art. In addition,thickening of the sealing member toward the inside of the liquid crystaldevice in the junction portion of the sealing member can be solved.

Further, according to a third aspect of the invention, in the method ofmanufacturing a liquid crystal device according to the first aspect ofthe invention, it is preferable that, in the forming of the sealingmember, the first sealing layer and a first side of the ring-shapedportion be formed on a coaxial straight line along which the sealingmember extends, and the second sealing layer be formed to face the firstsealing layer.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the first sealinglayer and the first side can be formed on the coaxial straight linealong which the sealing member extends, that is, the first sealing layercan be formed so as to be continuous with respect to the first side.Further, the second sealing layer can be formed to face the firstsealing layer.

Further, since the first sealing layer and the first side are formed onthe coaxial straight line, drawing time can be reduced, as compared withthe case in which the first sealing layer is formed while drawing thecurve or inclined line.

Further, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable that,when a line width of the sealing member in the ring-shaped portion afterthe bonding of the first substrate to the second substrate is performedis w1, and a distance between the central line of the first sealinglayer and the central line of the second sealing layer is d1, thefollowing relationship be established.

0≦d1≦0.8×w1  Equation 8

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, even when thevariation of the size of the sealing member occurs, the first sealinglayer and the second sealing layer are reliably joined, thereby formingthe junction portion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable that,in the forming of the sealing member, in an axis direction perpendicularto an axis direction of the first side of the ring-shaped portion, asecond side be formed, and the second sealing layer be formed so as tobe continuous with respect to the second side via a curved portion.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the second sealinglayer, which is connected to the second side via the curved portion, andthe first sealing layer are joined, thereby reliably forming thejunction portion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable that,when the radius of the curved is R1, the following relationship beestablished.

(R1/w1)≦−2.0×(d1/w1)+3.0  Equation 9

In addition, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable thatthe following equation be established.

(R1/w1)≦−1.7×(d1/w1)+2.0  Equation 10

(R1/w1)≧−1.2×(d1/w1)+1.0  Equation 11

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, leakage of the liquidcrystal layer from the ring-shaped portion can be prevented, regardlessof the size of the sealing member.

Further, the sealing member can be drawn at the same speed all over.Further, since a writing start portion or a writing end portion issufficiently separated from the liquid crystal device, a complex controlcan be eliminated. Accordingly, drawing time can be markedly reduced tohalf to one-third of drawing time in the related art. In addition,thickening of the sealing member toward the inside of the liquid crystaldevice in the junction portion of the sealing member can be solved.

Further, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable that,in the forming of the sealing member, in an axis direction perpendicularto an axis direction of the first side of the ring-shaped portion, asecond side be formed, and the second sealing layer be formed so as tobe continuous with respect to the second side via an inclined portion.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, the second sealinglayer, which is connected to the second side via the inclined portion,and the first sealing layer are joined, thereby reliably forming thejunction portion.

Further, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable that,when a chamfered amount of the inclined portion is c1, the followingrelationship be established.

(c1/w1)≦−0.5×(d1/w1)+1.2  Equation 12

In addition, in the method of manufacturing a liquid crystal deviceaccording to the third aspect of the invention, it is preferable thatthe following relationship be established.

(c1/w1)≦−0.5×(d1/w1)+0.7  Equation 13

(c1/w1)≧−0.5×(d1/w1)+0.3  Equation 14

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, leakage of the liquidcrystal layer from the ring-shaped portion can be prevented, regardlessof the size of the sealing member.

Further, the sealing member can be drawn at the same speed all over.Further, since a writing start portion or a writing end portion issufficiently separated from the liquid crystal device, a complex controlcan be eliminated. Accordingly, drawing time can be markedly reduced tohalf to one-third of drawing time in the related art. In addition,thickening of the sealing member toward the inside of the liquid crystaldevice in the junction portion of the sealing member can be solved.

Further, according to a fourth aspect of the invention, in the method ofmanufacturing a liquid crystal device according to the first aspect, itis preferable that a first base substrate having a plurality of firstelement regions be divided at mutual boundary portions of the pluralityof first element regions, such that the first substrate is obtained foreach first element region, and a second base substrate having aplurality of second element regions be divided at mutual boundaryportions of the plurality of second element regions, such that thesecond substrate is obtained for each second element region.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, since the pluralityof first element regions and the plurality of second element regions aredivided and taken out from the first base substrate and the second basesubstrate, respectively. Therefore, the plurality of the liquid crystaldevices each having the first substrate and the second substrate can betaken out. As a result, a manufacturing method having excellentproductivity can be implemented.

Further, according to a fifth aspect of the invention, in the method ofmanufacturing a liquid crystal device according to the fourth aspect ofthe invention, it is preferable that the forming of the sealing memberhas forming a first sealing member which serves as one of the firstsealing layer and the second sealing layer, and a part of thering-shaped portion, and after forming the first sealing member, forminga second sealing member which serves as the other of the first sealinglayer and the second sealing layer, and a remaining part of thering-shaped portion.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained. In addition, a liquid crystaldevice having the sealing member, which has the first sealing member andthe second sealing member, can be manufactured. When the sealing memberhas one sealing member, it is difficult to form the ring-shaped portion,the first sealing layer, the second sealing layer, and the junctionportion with different sealing materials. In contrast, according to theaspect of the invention, the sealing materials can be individuallyselected for the first sealing member and the second sealing member.Therefore, for a specified part from the parts at which the sealingmember is formed, one of the first sealing member and the second sealingmember can be selectively formed.

Further, in the method of manufacturing a liquid crystal deviceaccording to the fifth aspect of the invention, it is preferable that,in the forming of the first sealing member, in an arrangement directionof the first element regions for the plurality of first element regionsand the mutual boundary portions in the first base substrate, or in anarrangement direction of the second element regions for the plurality ofsecond element regions and the mutual boundary portions in the secondbase substrate, the first sealing member be continuously andcollectively formed.

Further, it is preferable that, after the forming of the first sealingmember is performed, in the forming of the second sealing member, in anarrangement direction of the first element regions for the plurality offirst element regions and the mutual boundary portions in the first basesubstrate, or in an arrangement direction of the second element regionsfor the plurality of second element regions and the mutual boundaryportions in the second base substrate, the second sealing member becontinuously and collectively formed.

If doing so, through a single process from the start of drawing of thefirst sealing member to the end of drawing and a single process from thestart of drawing of the second sealing member to the end of drawing, thesealing member can be collectively formed with respect to thearrangement direction of the plurality of first element regions or theplurality of second element regions. Therefore, the sealing member canbe easily and rapidly formed, and thus a manufacturing method havingexcellent productivity can be implemented.

On the other hand, when the sealing member is separately formed for eachof the plurality of first element regions or the plurality of secondelement regions, the start of drawing and the end of drawing should beperformed for each region, and then the start of drawing and the end ofdrawing should be repeatedly performed for the plurality of firstelement regions or the plurality of second element regions. Therefore,since the ejection and the non-ejection of the sealing material arecontinuously performed, it is difficult to cause the sealing material inthe dispenser to stably flow, and the variation in the amount of thesealing material to be ejected tends to occur. Further, since thedispenser should scan the first base substrate or the second basesubstrate, the operation of the dispenser is complicated.

In contrast, in the invention, the first sealing member and the secondsealing member are continuously and collectively formed in thearrangement direction of the first element regions or the second elementregions, and thus the start of drawing and the end of drawing can beperformed for each column or each row of the first element regions orthe second element regions, such that the number of starts of drawingand the number of ends of drawing can be reduced. Therefore, the firstsealing member and the second sealing member can be continuously andcollectively formed, while causing the sealing material in the dispenserto stably flow. Further, the sealing member can be formed in short time.Further, since the dispenser does not scan the first element regions orthe second element regions in a non-ejection state, the sealing materialfilled in the dispenser can be prevented from being inadvertentlydropped. As a result, the operation of the dispenser can be simplified,and the variation in viscosity of the sealing material or the variationin the ejection amount can be suppressed.

Further, the sealing members of the first element regions and the secondelement regions formed in such a manner are joined via the junctionportion, and thus leakage of a liquid crystal material between adjacentregions can be prevented.

Further, in the method of manufacturing a liquid crystal deviceaccording to the fifth aspect of the invention, it is preferable thatthe forming of the first sealing member and the forming of the secondsealing member be performed on the first base substrate or the secondbase substrate. Further, it is preferable that the forming of the firstsealing member and the forming of the second sealing member be performedon only one of the first base substrate and the second base substrate.

If doing so, the same effects as those in the above-describedmanufacturing method can be obtained.

Further, according to a sixth aspect of the invention, a liquid crystaldevice includes a first substrate and a second substrate that face eachother with a liquid crystal layer interposed therebetween, and a sealingmember that are formed in peripheral portions of both substrates. Theliquid crystal device is manufactured by the method of manufacturing aliquid crystal device described above.

If doing so, since the ring-shaped portion is blocked by the part of thejunction portion, leakage of the liquid crystal material from thejunction portion can be suppressed, and reliability of the liquidcrystal device can be enhanced. Further, since the junction portion isformed outside the ring-shaped portion, excluding the part for blockingthe ring-shaped portion, even when the width of the junction portion isthickened by bonding the first substrate to the second substrate, thewidth of the junction portion is increased only outside the ring-shapedportion, and thus the sealing member can be suppressed from protrudinginside the ring-shaped portion. Further, there is no case in which thecell gap inside the ring-shaped portion is influenced, and thus the cellgap can be uniformly maintained. Further, as compared with the relatedart, the width of each member of the ring-shaped portion and thejunction portion does not need to be adjusted, and the ring-shapedportion and the junction portion can be formed with a member having thesame width.

Further, in the liquid crystal device according to the sixth aspect ofthe invention, it is preferable that the sealing member have a singlemember, the liquid crystal layer be held in a portion surrounded by thesingle member in a ring shape, and the junction portion join one end andthe other end of the single member at a single place.

Here, ‘the sealing member is formed of the single member’ means onewhich is formed by continuously ejecting the sealing material from thebeginning to the termination, that is, one which is formed by ejectingthe sealing material with so-called one stroke of a brush, unlike thesealing member having the first sealing member and the second sealingmember to be described below.

If doing so, the same effects as those in the above-described liquidcrystal device can be obtained. In addition, a liquid crystal devicehaving the sealing member, which has the single member, can beimplemented. Further, since the ring-shaped portion is blocked by thejunction portion, which joins the beginning and the termination of thesealing member at one place, the junction portion can be formed to theminimum. Therefore, as compared with the case in which the plurality ofjunction portions are provided, the liquid crystal device in which thedefective cell gap is more reliably suppressed can be implemented.

Further, in the liquid crystal device according to the sixth aspect ofthe invention, it is preferable that the sealing member have a firstsealing member and a second sealing member, the ring-shaped portion holdthe liquid crystal layer in a portion surrounded by the first sealingmember and the second sealing member in a ring shape, and the junctionportion join one ends of the first sealing member and the second sealingmember and also join the other ends of the first sealing member and thesecond sealing member.

If doing so, the same effect as those in the above-described liquidcrystal device can be obtained. In addition, a liquid crystal devicehaving the sealing member, which has the first sealing member and thesecond sealing member, can be implemented. When the sealing member has asingle member, it is difficult to form the ring-shaped portion or thejunction portion with different sealing materials. In contrast,according to the aspect of the invention, the sealing material can beselected for each of the first sealing member and the second sealingmember. Therefore, for a specified part from the parts at which thesealing member is formed, one of the first sealing member and the secondsealing member can be selectively formed.

Further, according to a seventh aspect of the invention, an electronicapparatus includes the liquid crystal device described above.

According to this configuration, an electronic apparatus having adisplay unit, which has excellent reliability and performs high-qualitydisplay, is provided.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a plan view of a liquid crystal device according to a firstembodiment of the invention.

FIG. 2 is a cross-sectional view of the liquid crystal device accordingto the first embodiment of the invention taken along the line II-II ofFIG. 1.

FIG. 3 is a plan view of parts of the liquid crystal device according tothe first embodiment of the invention.

FIG. 4 is a plan view of parts of the liquid crystal device according tothe first embodiment of the invention.

FIG. 5 is an equivalent circuit diagram of the liquid crystal deviceaccording to the first embodiment of the invention.

FIG. 6 is a plan view of various elements of the liquid crystal deviceaccording to the first embodiment of the invention.

FIG. 7A is a diagram schematically illustrating a method ofmanufacturing a liquid crystal device according to an embodiment of theinvention.

FIG. 7B is a diagram schematically illustrating a method ofmanufacturing a liquid crystal device according to the embodiment of theinvention.

FIG. 7C is a diagram schematically illustrating a method ofmanufacturing a liquid crystal device according to the embodiment of theinvention.

FIG. 8 is a diagram showing the configuration of a device manufacturingapparatus which is used for a method of manufacturing a liquid crystaldevice according to the embodiment of the invention.

FIG. 9 is a diagram showing the configuration of a substrate load/unloadunit and a material supply unit which are used for a method ofmanufacturing a liquid crystal device according to the embodiment of theinvention.

FIG. 10 is a diagram showing the configuration of a substrate bondingunit which is used for a method of manufacturing a liquid crystal deviceaccording to the embodiment of the invention.

FIG. 11 is a diagram showing the configuration of a precise alignmentunit which is used for a method of manufacturing a liquid crystal deviceaccording to the embodiment of the invention.

FIG. 12A is a diagram showing the configuration of an example of aliquid droplet ejection head which is used for a method of manufacturinga liquid crystal device according to the embodiment of the invention.

FIG. 12B is a diagram showing the configuration of an example of aliquid droplet ejection head which is used for a method of manufacturinga liquid crystal device according to the embodiment of the invention.

FIG. 13 is a diagram illustrating a driving voltage waveform and anoperation of a piezoelectric element in the liquid droplet ejection headof FIG. 12.

FIG. 14A is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 14B is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 14C is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 15A is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 15B is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 15C is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 16A is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 16B is a diagram illustrating a method of manufacturing a liquidcrystal device according to the embodiment of the invention.

FIG. 17A is a diagram showing a method of forming a sealing member in amethod of manufacturing a liquid crystal device according to theembodiment of the invention.

FIG. 17B is a diagram showing a method of forming a sealing member in amethod of manufacturing a liquid crystal device according to theembodiment of the invention.

FIG. 18A is a diagram showing the appearance of a mother substrate in amethod of manufacturing a liquid crystal device according to theembodiment of the invention.

FIG. 18B is a diagram showing the appearance of a mother substrate in amethod of manufacturing a liquid crystal device according to theembodiment of the invention.

FIG. 18C is a diagram showing the appearance of a mother substrate in amethod of manufacturing a liquid crystal device according to theembodiment of the invention.

FIG. 19 is a plan view showing parts of a sealing member of a liquidcrystal device according to a second embodiment of the invention.

FIG. 20 is a plan view of a liquid crystal device according to a thirdembodiment of the invention.

FIG. 21 is a plan view of parts of the liquid crystal device accordingto the third embodiment of the invention.

FIG. 22 is a plan view of parts of the liquid crystal device accordingto the third embodiment of the invention.

FIG. 23A is a diagram showing a method of forming a sealing member ofthe liquid crystal device according to the third embodiment of theinvention.

FIG. 23B is a diagram showing a method of forming a sealing member ofthe liquid crystal device according to the third embodiment of theinvention.

FIG. 24A is a plan view showing parts of a sealing member of the liquidcrystal device according to the third embodiment of the invention.

FIG. 24B is a plan view showing parts of a sealing member of the liquidcrystal device according to the third embodiment of the invention.

FIG. 24C is a plan view showing parts of a sealing member of the liquidcrystal device according to the third embodiment of the invention.

FIG. 25 is a plan view showing parts of a sealing member of a liquidcrystal device according to a fourth embodiment of the invention.

FIG. 26 is a plan view of a liquid crystal device according to a fifthembodiment of the invention.

FIG. 27 is a plan view of a liquid crystal device according to a sixthembodiment of the invention.

FIG. 28 is a plan view of a liquid crystal device according to a seventhembodiment of the invention.

FIG. 29 is a plan view of a liquid crystal device according to amodification of the seventh embodiment of the invention.

FIG. 30 is a plan view of a liquid crystal device according to an eighthembodiment of the invention.

FIG. 31 is a plan view of a liquid crystal device according to a ninthembodiment of the invention.

FIG. 32 is a diagram illustrating an example of the invention.

FIG. 33 is a diagram illustrating an example of the invention.

FIG. 34 is a diagram illustrating an example of the invention.

FIG. 35 is a diagram illustrating an example of the invention.

FIG. 36 is a diagram illustrating an example of the invention.

FIG. 37 is a diagram illustrating an example of the invention.

FIG. 38 is a diagram illustrating an example of the invention.

FIG. 39 is a diagram illustrating an example of the invention.

FIG. 40 is a diagram illustrating an example of the invention.

FIG. 41 is a diagram illustrating an example of the invention.

FIG. 42 is a diagram illustrating an example of the invention.

FIG. 43 is a diagram illustrating an example of the invention.

FIG. 44 is a diagram illustrating an example of the invention.

FIG. 45 is a diagram illustrating an example of the invention.

FIG. 46 is a diagram illustrating an example of the invention.

FIG. 47A is a perspective view showing an electronic apparatus accordingto the embodiment of the invention.

FIG. 47B is a perspective view showing an electronic apparatus accordingto the embodiment of the invention.

FIG. 47C is a perspective view showing an electronic apparatus accordingto the embodiment of the invention.

FIG. 48A is a diagram illustrating the related art.

FIG. 48B is a diagram illustrating the related art.

FIG. 48C is a diagram illustrating the related art.

FIG. 48D is a diagram illustrating the related art.

FIG. 49 is a diagram illustrating the related art.

FIG. 50 is a diagram illustrating the related art.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, embodiments of a liquid crystal device, a method ofmanufacturing a liquid crystal device, and an electronic apparatusaccording to an embodiment of the invention will be described withreference to the drawings. Moreover, in the respective drawings used forthe following description, the scale of each layer or member has beenadjusted in order to have a recognizable size.

First Embodiment

First, a liquid crystal device according to a first embodiment of theinvention will be described.

The liquid crystal device of the present embodiment described below isan example of an active matrix type liquid crystal device which uses athin film diode (hereinafter, referred to as TFD) as a switchingelement. The liquid crystal device of the present invention is also atransmissive liquid crystal device in which transmissive display can beperformed.

FIG. 1 is a plan view of individual constituent parts of the liquidcrystal device according to the present embodiment as viewed from acounter substrate. FIG. 2 is a cross-sectional view taken along the lineII-II of FIG. 1. Further, FIG. 3 is a plan view showing a region denotedby a symbol C in FIG. 1 on a magnified scale. FIG. 4 is a plan viewillustrating the configuration of a sealing member in detail. FIG. 5 isan equivalent circuit diagram of various elements, wiring lines, and thelike in a plurality of pixels formed in an image display region 4 of theliquid crystal device in a matrix shape. FIG. 6 is a diagramillustrating planar electrode structures (pixel structures) of variouselements.

As shown in FIGS. 1 to 3, the liquid crystal device 100 of the presentembodiment primarily has a TFD substrate (first substrate) 10, a countersubstrate (second substrate) 20, a sealing member 52, and a liquidcrystal layer 50. Further, the sealing member 52 is formed in peripheralportions of the TFD substrate 10 and the counter substrate 20 to beinterposed between both substrates. In addition, the liquid crystallayer 50 is filled and held between the TFD substrate 10 and the countersubstrate 20 and inside the sealing member 52.

Next, the individual constituent parts will be described in detail.

The TFD substrate 10 is formed of a transparent member, such as a glasssubstrate or the like. On a surface of the TFD substrate 10, the imagedisplay region 4, the sealing member 52, a periphery sacrificial member53, a conductive pad (first conductive portion or conductive region) 54,a scanning signal driving circuit 110, and a data signal driving circuit120 are provided.

In the image display region 4, a plurality of dots are formed in amatrix shape, and, for each dot, a pixel electrode 31 and a TFD element40 are formed. The pixel electrode 31 is a transparent electrodeprimarily formed of ITO (Indium Tin Oxide). The TFD element 40 isconnected to the scanning signal driving circuit 110 via an SEGelectrode 56, such that a driving signal of the scanning signal drivingcircuit 110 is applied to the pixel electrode 31 as a potential. On asurface of the pixel electrode 31, an alignment film, which is primarilyformed of polyimide to be subjected to a rubbing treatment, is formed,such that the alignment of liquid crystal molecules of the liquidcrystal layer 50 with no voltage applied thereto is parallel to arubbing direction. The periphery sacrificial member 53 is formed of alight-shielding material between the image display region 4 and thesealing member 52. The conductive pad 54 is connected to the data signaldriving circuit 120 via a relay wiring line shown in FIG. 3 so as to beelectrically connected to a COM electrode (second conductive portion orconductive region) 57, which is formed in a counter substrate 20 to bedescribed below. The scanning signal driving circuit 110 and the datasignal driving circuit 120 are formed at one side of the TFD substrate10 (the left side of FIG. 1). Then, the SEG electrode 56 which extendsfrom the scanning signal driving circuit 110, overlaps the sealingmember 52 (52 a) between the scanning signal driving circuit 110 and theimage display region 4. Further, the relay wiring line 55, which extendsfrom the data signal driving circuit 120, overlaps the sealing member 52(52 a) between the data signal driving circuit 120 and the conductivepad 54.

Moreover, in FIG. 3, some of the relay wiring lines 55, a part of theconductive pad 54, and some of the COM electrodes 57 are shown.Actually, the same number of the relay wiring lines 55 as the number ofterminals of the data signal driving circuit 120 are formed, and aplurality of conductive pads 54 and a plurality of COM electrodes 57 areformed in a horizontal direction of FIG. 1.

On the counter substrate 20, in a region facing the boundary region ofthe pixel electrodes on the TFD substrate 10, a light-shielding film 23,which is called a black matrix or a black stripe, is formed, and a pixelelectrode 9 formed of ITO film is formed thereon. Further, on the pixelelectrode 9, an alignment film, which is primarily formed of polyimideto be subjected to the rubbing treatment, is formed. Further, as shownin FIG. 3, outside the image display region 4, the COM electrode 57 isformed at a position where the pixel electrode 9 extends. The COMelectrode 57 is formed to face the conductive pad 54, such that asealing member 52 b (described below) containing conductive particles isinterposed between the COM electrode 57 and the conductive pad 54.Therefore, a driving signal of the data signal driving circuit 120 isapplied to the pixel electrode 9 as a potential via the relay wiringline 55, the conductive pad 54, the conductive particles, and the COMelectrode 57.

The sealing member 52 has an insulating sealing member (second sealingmember) 52 a and a conductive sealing member (first sealing member) 52b.

Here, the insulating sealing member 52 a is a sealing member having anelectrical insulation property, and the conductive sealing member 52 bis a sealing member having conductivity. The insulating sealing member52 a is formed in a non-conductive region on the relay wiring line 55and the SEG electrode 56 so as to cause a non-conduction state between aplurality of wiring lines or electrodes in the relay wiring line 55 andthe SEG electrode 56. On the other hand, the conductive sealing member52 b is formed in a conductive region of the conductive pad 54 or theCOM electrode 57 so as to cause a conduction state between theconductive pad 54 and the COM electrode 57.

Further, while the conductive sealing member 52 b contains theconductive particles, the insulating sealing member 52 a does notcontain conductive particles. As the conductive particles, particles ofconductive material, such as metal particles or the like, particlesobtained by performing a plating treatment on the surface of resin, orthe like are adopted. The conductive particles have elasticity, andthus, when the TFD substrate 10 and the counter substrate 20 are bondedto each other, the conductive pad 54 and the COM electrode 57 press theconductive particles, such that the conductive pad 54 and the COMelectrode 57 are in conductive states.

Further, for any one of the insulating sealing member 52 a and theconductive sealing member 52 b, as a primary sealing material, athermosetting or ultraviolet curable resin material or a resin materialhaving both the thermosetting and ultraviolet curable characteristicsaccording to a curing process is adopted. In the present embodiment,World Lock No. 717, supplied by Kyoritsu Chemical & Co., Ltd., isadopted as the sealing member 52. This material has viscosity of 400,000mPa·s, and the thickness of the sealing member 52 after bonding is 8 μm.

In addition, the insulating sealing member 52 a and the conductivesealing member 52 b are formed in a pattern shown in FIG. 4, and thus asingle ring-shaped portion 58 for holding the liquid crystal layer 50therein and junction portions 59 for the insulating sealing member 52 aand the conductive sealing member 52 b are constituted. The sealingmember 52 formed in such a pattern is formed in a closed frame shapewithin the surface of the TFD substrate 10 with no liquid crystal hole.Further, the sealing member 52 is formed by ejecting the sealingmaterial onto the TFD substrate 10 or the counter substrate 20 from adispenser, which is then pressed by the TFD substrate 10 and the countersubstrate 20 so as to be compressed, such that a predetermined cell gapis maintained.

In the ring-shaped portion 58, the insulating sealing member 52 a isformed so as to pass through points R, S, T, and O in FIG. 4 and theconductive sealing member 52 b is formed so as to pass through points O,P, Q, and R in FIG. 4.

In the junction portions 59, the insulating sealing member 52 a and theconductive sealing member 52 b are joined at points O and R. Therefore,the junction portions 59 are formed at a place on the side TP and at aplace on the side SQ. That is, the junction portions 59 are individuallyformed on opposite sides of the ring-shaped portion 58.

Further, the junction portions 59 are formed so as to be continuous withrespect to the ring-shaped portion 58 and block (close) the ring-shapedportion 58 at the points O and R. Accordingly, the liquid crystal layer50 held inside the ring-shaped portion 58 can be prevented from leakingoutside the sealing member 52. Further, at the points O and R, parts ofthe individual junction portions 59 are integrated into the ring-shapedportion 58, and the other parts of the individual junction portions 59are formed outside the ring-shaped portion 58. That is, the junctionportions 59 are formed toward the outside of the ring-shaped portion 58from the portions for blocking the ring-shaped portion 58 (points O andR). Therefore, the junction portions 59 are not formed to overlap thering-shaped portion 58. Only parts of the individual junction portions59 join the ring-shaped portion 58 and the other parts thereof areformed toward the outside of the ring-shaped portion 58.

Further, as shown in FIG. 3, the junction portion 59 is formed betweenan end (symbol A) of the conductive pad 54 and an end (symbol B) of therelay wiring line 55 crossing the sealing member 52, that is, in aportion indicated by a symbol L. In the liquid crystal device 100 of thepresent embodiment, the distance denoted by the symbol L is set to beequal to or less than 2 mm.

Further, as described below, the junction portions 59 are formed bydrawing the insulating sealing member 52 a and the conductive sealingmember 52 b from the dispenser in a non-contact state to face eachother, and then pressing the sealing members 52 a and 52 b through thebonding process so as to be contacted and joined.

The liquid crystal layer 50 is disposed inside the ring-shaped portion58. For example, the liquid crystal layer 50 is ejected and formed by anink jet method (liquid droplet ejection method) or a dispenser method.Further, the thickness of the liquid crystal layer 50 is determined tohave the predetermined cell gap in connection with the thickness of thesealing member 52. Further, for the liquid crystal layer 50, a materialis suitably selected according to an operation mode of the liquidcrystal device 100, for example, an operation mode, such as a TN(Twisted Nematic) mode or an STN (Super Twisted Nematic) mode, or anormally white mode/normally black mode.

Next, the image display region 4 of the liquid crystal device 100 willbe described in detail.

As shown in the equivalent circuit of FIG. 5, the liquid crystal device100 has a plurality of scanning lines 13 and a plurality of data lines(pixel electrodes) 9 crossing the scanning lines 13. The scanning lines13 are driven by the scanning signal driving circuit 110 and the datalines are driven by the data signal driving circuit 120. Here, thescanning lines 13 are correspondingly connected to the SEG electrodes 56outside the image display region 4. Therefore, in each pixel region 150,the TFD element 40 and a liquid crystal display element 160 (liquidcrystal layer 150) are connected in series between the scanning line 13and the data line 9. Moreover, in FIG. 5, the TFD element 40 isconnected to the scanning line 13, and the liquid crystal displayelement 160 is connected to the data line 9. Alternatively, the TFDelement 40 may be connected to the data line 9, and the liquid crystaldisplay element 160 may be connected to the scanning line 13.

Further, as shown in the planar electrode structure of FIG. 6, in theliquid crystal device 100, the pixel electrodes 31, which haverectangular shapes in plan view and are connected to the scanning lines13 via the TFD elements 40, are provided in a matrix shape. The pixelelectrodes 9 are provided in stripe shape so as to face the pixelelectrodes 31 in a vertical direction of FIG. 6. The pixel electrodes 9are formed by the data lines and have the stripe shape so as to crossthe scanning lines 13. In the present embodiment, an individual regionin which each pixel electrode 31 is formed is one dot region, and theTFD elements 40 are provided in the individual dot regions arranged in amatrix shape, such that display can be performed for each dot region.

Here, the TFD element 40 is a switching element for connecting thescanning line 13 and the pixel electrode 31. The TFD element 40 has anMIM structure which includes a first conductive film primarily formed oftantalum (Ta), an insulating film formed on the surface of the firstconductive film and primarily formed of Ta₂O₃, and a second conductivefilm formed on the surface of the insulating film and primarily formedof chromium (Cr). Further, the first conductive film of the TFD element40 is connected to the scanning line 13, and the second conductive filmthereof is connected to the pixel electrode 31.

Moreover, the scanning signal driving circuit 110 and the data signaldriving circuit 120 may be not formed on the TFD substrate 10.Alternatively, a TAB (Tape Automated Bonding) substrate with a drivingLSI mounted thereon may be electrically and mechanically connected viaan anisotropy conductive film to a group of terminals which is formed inthe peripheral portion of the TFD substrate 10. Moreover, in the liquidcrystal device 100, a retardation plate, a polarizing plate, and thelike, which are not shown in the drawings, may be disposed in apredetermined direction according to the kind of the liquid crystallayer 50 to be used, that is, the operation mode, such as the TN(Twisted Nematic) mode or the STN (Super Twisted Nematic) mode, or thenormally white mode/normally black mode. Further, when the liquidcrystal device 100 is constituted for color display, in regions facingindividual pixel electrodes of the TFD substrate 10 described below inthe counter substrate 20, color filters of R, G, and B, and a protectivefilm for protecting the color filters may be formed.

Next, a method of manufacturing a liquid crystal device according to thefirst embodiment of the invention will be described.

First, in the following description, (1) Schematic Description ofManufacturing Method of Liquid Crystal Device, (2) Device ManufacturingApparatus, and (3) Detailed Description of Manufacturing Method ofLiquid Crystal Device will be sequentially described.

(1) Schematic Description of Manufacturing Method of Liquid CrystalDevice

FIGS. 7A to 7C are diagrams schematically illustrating the method ofmanufacturing a liquid crystal device.

First, as shown in FIG. 7A, a mother substrate 10′ for a TFD substrate(first base substrate) and a mother substrate 20′ for a countersubstrate (second base substrate) are prepared.

In the mother substrate 10′ for the TFD substrate (first basesubstrate), a plurality of TFD formation regions (first element regions)11 are divided and formed. Further, a periphery of each divided TFDformation region 11 becomes a mutual boundary portion 12. Next, on themother substrate 10′ for a TFD substrate, a semiconductor manufacturingprocess including a known photolithography technology is performed, suchthat the TFDs 40, the pixel electrodes 31, the conductive pad 54, therelay wiring lines 55, the SEG electrodes 56, the alignment film, andthe like are formed in the individual TFD formation regions 11.Moreover, the scanning signal driving circuit 110 and the data signaldriving circuit 120 may be simultaneously incorporated into the TFDformation region 11.

On the other hand, in the mother substrate 20′ for a counter substrate,a plurality of counter electrode formation regions (second elementregions) 21 are divided and formed. Further, a periphery of each dividedcounter electrode formation region 21 becomes a mutual boundary portion22. Next, on the mother substrate 20′ for a counter substrate, asemiconductor manufacturing process including a known photolithographytechnology is performed, such that the pixel electrodes 9, the COMelectrodes 57, the alignment film, and the like are formed in theindividual counter electrode formation regions 21.

Here, the number of TFD formation regions 11 is the same as the numberof counter electrode formation regions 21. Further, when the mothersubstrate 10′ for a TFD substrate and the mother substrate 20′ for acounter substrate are bonded to each other, the individual regions 11and 21 are positioned with respect to each other with high precision.

Next, as shown in FIG. 7B, the mother substrate 10′ for a TFD substrateand the mother substrate 20′ for a counter substrate are bonded to eachother. Here, the mother substrate 10′ for a TFD substrate and the mothersubstrate 20′ for a counter substrate are bonded to each other in astate in which the sealing member or the liquid crystal layer 50described below is interposed therebetween.

Next, as shown in FIG. 7C, in a state in which the mother substrates 10′and 20′ are bonded to each other, the mother substrates 10′ and 20′ aredivided and cut along the mutual boundary portions 12 and 22, such thata plurality of liquid crystal devices 100 are formed.

(2) Device Manufacturing Apparatus

Next, a device manufacturing apparatus which performs processes of theformation of the sealing member 52, the formation of the liquid crystallayer 50 by dropping liquid droplets, bonding of the substrates, andcuring of the sealing member 52 in the manufacturing process of theliquid crystal device 100 will be described.

FIG. 8 is a diagram showing the schematic configuration of the devicemanufacturing apparatus 61.

As shown in FIG. 8, the device manufacturing apparatus 61 primarily hasa substrate load/unload unit 62 that loads and unloads a substrate, amaterial supply unit 63, a substrate bonding unit 64, and a precisealignment unit 164.

FIG. 9 is a diagram showing the schematic configurations of thesubstrate load/unload unit 62 and the material supply unit 63. Moreover,hereinafter, on an assumption that directions along the surface of thesubstrate are referred to as an X direction (for example, a horizontaldirection in FIG. 9) and a Y direction (for example, a verticaldirection to the paper in FIG. 9), and a direction perpendicular to anXY plane is referred to as a Z direction, the description will be given.

As shown in FIG. 9, the material supply unit 63 primarily has a table 65which freely moves in the X direction, the Y direction, and a θdirection (rotation direction around an axis parallel to the Z axis)while holding the substrate, a liquid droplet ejection head 66 that isdisposed above the table 65 so as to eject and drop a liquid crystalmaterial (electro-optical material), and sealing material coating units67 a and 67 b that are disposed in the vicinity of the liquid dropletejection head 66 so as to coat the sealing material.

In the sealing material coated by the sealing material coating units 67a and 67 b, a substantially spherical gap control material is included,the diameter of the gap control material is formed to have theappropriate size (for example, the diameter of 8 μm) to maintain thecell gap of the substrate at a predetermined thickness (for example, 3μm). The diameter (about 8 μm) of the gap control material is set tomaintain the thickness (about 5 μm) of the color filter in the displayregion or the like and the cell gap (3 μm).

Further, the sealing material coating unit 67 a coats the insulatingsealing member 52 a and the sealing material coating unit 67 b coats theconductive sealing member 52 b.

Moreover, in order to drop the liquid crystal material, in addition tothe liquid droplet ejection head 66, any device may be used as long asthe dropping amount of the liquid crystal material can be controlled.For example, a precise liquid ejector (measuring dispenser) or the likemay be used. Further, the gap control material is not limited to aspherical shape or one included in the sealing material. For example,various gap control materials, such as one which is formed in a fibrousshape and is included in the sealing material, one which is formed toprotrude from the substrate in a columnar shape, not included in thesealing material, and the like, can be used. Preferably, one, which isfixed at a predetermined position of the substrate and does not move onthe substrate at the time of bonding the substrates or the like, isused.

Further, the substrate load/unload unit 62 primarily has a carrier whichtransfers the substrate between the material supply unit 63 and thesubstrate bonding unit 64 and between the substrate bonding unit 64 andthe precise alignment unit 164.

Moreover, in addition to the configuration shown in FIG. 9, thesubstrate load/unload unit 62 may be configured to have a transfer robotor a unit having a transfer function for connecting the material supplyunit 63, the substrate bonding unit 64, and the precise alignment unit164.

FIG. 10 is a diagram showing the schematic configuration of thesubstrate bonding unit 64.

As shown in FIG. 10, the substrate bonding unit 64 is configured to havea table 68 that freely moves in the X direction, the Y direction, andthe θ direction while holding the substrate, a lower chuck unit 69 thatis disposed on the table 68, a vacuum chamber 70 that is disposed abovethe lower chuck unit 69, an upper chuck unit 71 that is disposed in thevacuum chamber 70 to face the lower chuck unit 69, and a descendingmechanism 72 that movably supports the upper chuck unit 71 in the Zdirection and presses the upper chuck unit 71 toward the lower chuckunit 69.

In a wall surface of the vacuum chamber 70, inspection windows 70 a andan exhaust portion 76 are provided. Above the inspection window 70 a,optical measuring units, each having a bonding microscope 74 thatmagnifies and observes an alignment mark on the substrate via theinspection window 70 a, and a CCD camera 81 that captures an image ofthe magnified and observed alignment mark, are provided. To the exhaustportion 76, a suction device 78 having a vacuum pump for exhausting gasin a housing space 70 b (drawing a vacuum) is connected.

Further, the vacuum chamber 70 has a UV irradiation unit 82. The UVirradiation unit 82 has a UV lamp, such as a mercury lamp or the like,for radiating ultraviolet rays to temporarily cure the sealing member52, and, if necessary, a light-guiding unit, such as a fiber or thelike.

Moreover, preferably, the UV irradiation unit 82 supplies sufficientenergy to increase the viscosity of the sealing member 52. Further, aunit for applying energy to the sealing member 52 is not limited to theUV lamp. For example, according to the nature of the sealing member 52,various devices, such as a heating/cooling device, a visible lightirradiation device, and the like, can be used.

In addition, in the substrate bonding unit 64, an image processing unit83 that processes the image captured by the CCD camera 81, and a controlunit 84 that controls the table 68 and the descending mechanism 72 onthe basis of image information processed by the image processing unit 83are provided.

Further, in the lower chuck unit 69 and the upper chuck unit 71, holdingmechanisms (not shown) for holding the substrate on holding surfaces 69a and 71 a, which face each other, are provided.

Moreover, in the lower chuck unit 69 and the upper chuck unit 71, anymechanism may be provided as long as the substrate can be held under avacuum atmosphere. For example, a chuck mechanism using electrostaticforce or adhesive force, or a mechanical holding mechanism formechanically holding the substrate may be used. Further, a holdingmethod using adhesive force, inter-molecular force, or vacuum force, ora mechanical holding method may be used.

FIG. 11 is a diagram showing the schematic configuration of the precisealignment unit 164.

The precise alignment unit 164 schematically has a table 168 that freelymoves in the X direction, the Y direction, and the θ direction whileholding the substrate, a lower chuck unit 169 that is provided on thetable 168, an upper chuck unit 171 that is disposed to face the lowerchuck unit 169, a pressing mechanism 172 that movably supports the upperchuck unit 171 in the Z direction and presses the upper chuck unit 171toward the lower chuck unit 169, microscopes 174 for alignment thatmagnify and observe the alignment mark on the substrate, and a UV lamp182, such as a mercury lamp or the like, that irradiates ultravioletrays to cure the sealing member 52. Each microscope 174 for alignmentconstitutes an optical measuring unit of the present apparatus, togetherwith a CCD camera 181 that captures an image of the magnified andobserved alignment mark.

Further, in the precise alignment unit 164, an image processing unit 183that processes the image captured by the CCD camera 181 and a controlunit 184 that controls the table 168 on the basis of image informationprocessed by the image processing unit 183 are provided.

In the lower chuck unit 169 and the upper chuck unit 171, attractionmechanisms (not shown) for vacuum-attracting the substrate onto holdingsurfaces 169 a and 171 a, which face each other, are provided.

Moreover, in the lower chuck unit 169 and the upper chuck unit 171, anymechanism may be provided as long as sufficient holding force to movethe bonded substrates in the X-axis direction and the Y-axis directioncan be exerted. For example, a chuck mechanism using electrostatic forceor adhesive force, or a mechanical holding mechanism for mechanicallyholding the substrate may be used.

Further, in the precise alignment unit 164, the pressing mechanism thatpresses the upper chuck unit 171 toward the lower chuck unit 169 may beprovided.

Further, the UV lamp 182 is sufficient to cure the sealing member 52. Inaddition to the UV lamp 182, for example, various devices, such as aheating/cooling device, a visible light irradiation device, and thelike, can be used according to the nature of the sealing member 52.

As the liquid droplet ejection head 66 shown in FIG. 6, for example, aliquid droplet ejection head having the configuration shown in FIG. 12Aor 12B can be used. In a head main body 90 of the liquid dropletejection head 66, a reservoir 95 and a plurality of ink chamber(pressure generating chambers) 93 are formed. The reservoir 95 is a flowchannel for supplying ink including an electro-optical material, such asliquid crystal or the like, to the individual ink chambers 93. Further,on one end surface of the head main body 90, a nozzle plate constitutingan ink ejection surface 66P is mounted. In the nozzle plate, a pluralityof nozzles 91 opens so as to eject ink. Further, a flow channel isformed from each ink chamber 93 toward the corresponding nozzle 91. Onthe other hand, on the other end surface of the head main body 90, avibrating plate 94 is mounted.

The vibrating plate 94 constitutes wall surfaces of the ink chambers 93.Outside the vibrating plate 94, piezoelectric elements (pressuregenerating unit) 92 are provided to correspond to the ink chambers 93.In each of the piezoelectric elements 92, a piezoelectric material, suchas crystal or the like, is interposed between a pair of electrodes (notshown).

FIG. 13 is a schematic view showing a driving voltage waveform W1 of thepiezoelectric element and the operation of the liquid droplet ejectionhead 66 according to the driving voltage. Hereinafter, a case in whichthe driving voltage of the waveform W1 is applied to the pair ofelectrodes constituting the piezoelectric element 92 will be described.First, in positive gradient portions a1 and a3, the piezoelectricelement 92 contracts, the volume of the ink chamber 93 is increased, andthen ink flows from the reservoir 95 into the ink chamber 93. Further,in a negative gradient portion a2, the piezoelectric element 92 expands,the volume of the ink chamber 93 is decreased, and then a pressed ink 99is ejected from the nozzle 91. The coating amount of ink is determinedaccording to the amplitude of the driving voltage waveform W1 or thenumber of application times.

Moreover, a driving method of the liquid droplet ejection head 66 is notlimited to a piezoelectric jet type using the piezoelectric element 92.For example, a thermal ink jet type using thermal expansion may beadopted. Further, as a unit for coating liquid crystal, in addition toan ink jet head, other coating units may be used. As a liquid crystalcoating unit, other than the ink jet head, for example, a dispenser maybe adopted. The dispenser has a large-diameter nozzle, as compared withthe ink jet head, and thus liquid crystal with high viscosity can beejected.

(3) Detailed Description of Manufacturing Method of Liquid CrystalDevice

Next, a process of manufacturing the liquid crystal device 100 by usingthe device manufacturing apparatus 61 will be described with referenceto FIGS. 14A to 18C.

Hereinafter, under an assumption that the pixel electrodes 9 and 31, andthe like described in FIG. 7A have already been formed in the mothersubstrate 10′ for a TFD substrate and the mother substrate 20′ for acounter substrate, the description will be given.

First, as shown in FIG. 14A, the mother substrate 10′ for a TFDsubstrate, on which the pixel electrodes 31 and the like are formed, istransported by the substrate load/unload unit 62, and is loaded on thetable 65 of the material supply unit 63 while turning a sealing surface10′a upward. Subsequently, while the table 65 is moved, the sealingmaterials are coated on the mother substrate 10′ for a TFD substratefrom the sealing material coating units 67 a and 67 b, such that thesealing member 52 is formed on the mother substrate 10′ for a TFDsubstrate (sealing member forming process). Here, the sealing member 52is formed by the insulating sealing member 52 a and the conductivesealing member 52 b. The insulating sealing member 52 a is coated fromthe sealing material coating unit 67 a, and the conductive sealingmember 52 b is coated from the sealing material coating unit 67 b.

Here, a method of forming the sealing member 52 will be described indetail.

FIGS. 17A and 17B are plan views illustrating the method of forming thesealing member 52. FIGS. 18A to 18C are plan views showing the sealingmember formed on the mother substrate. FIG. 18A is a diagram showing theappearance of the mother substrate, FIG. 18B is a diagram of a portionindicated by a symbol E in FIG. 18A on a magnified scale, and FIG. 18Cis a diagram of a portion indicated by a symbol F in FIG. 18B on amagnified scale.

As shown in FIG. 17A, the insulating sealing member 52 a is coated onthe mother substrate 10′ for a TFD substrate in a direction indicated bya symbol U (second sealing member forming process). Here, as describedabove, the plurality of TFD formation regions 11 and the mutual boundaryportions 12 are formed on the mother substrate 10′ for a TFD substrate,and then the insulating sealing member 52 a is continuously andcollectively coated to cover the TFD formation regions 11 and the mutualboundary portions 12. Further, the direction indicated by the symbol Urepresents the same direction as the arrangement direction of theplurality of TFD formation regions 11.

Here, when the insulating sealing member 52 a is coated and formed, afirst side 58 a, which is a part of the ring-shaped portion 58, isformed on a lateral side of the TFD formation region 11. Further, in themutual boundary portion 12, a first sealing layer 59 a, which is formedso as to be continuous with respect to the first side 58 a, is formed.Here, the first sealing layer 59 a is formed in an indented portion Wwhich is indented toward the TFD formation region 11 from an extendedaxis direction (symbol U) of the first side 58 a in the mutual boundaryportion 12. The indented portion W is formed in a so-called ‘U’ shape.

Next, as shown in FIG. 17B, the conductive sealing member 52 b is coatedon the mother substrate 10′ for a TFD substrate in a direction indicatedby a symbol V (first sealing member forming process). In this process,like the insulating sealing member 52 a, the conductive sealing member52 b is continuously and collectively coated to cover the plurality ofTFD formation regions 11 and the mutual boundary portions 12. Further,the direction indicated by the symbol V represents the same direction asthe arrangement direction of the plurality of TFD formation regions 11.

Here, when the conductive sealing member 52 b is coated and formed, asecond side 58 b, which is a part of the ring-shaped portion 58, isformed in an axis direction perpendicular to the extended axis (symbolV) of the first side 58 a, and a third side 58 c is formed on a lateralside of the TFD formation region 11 to face the first side 58 a.Further, in the mutual boundary portion 12, a second sealing layer 59 b,which is formed so as to be continuous with respect to the second side58 b, is formed. Here, the second sealing layer 59 b is formed in anindented portion X which is indented toward the TFD formation region 11from an extended axis direction of the third side 58 c in the mutualboundary portion 12. The indented portion X is in a so-called ‘U’ shape.

Further, the first sealing layer 59 a and the second sealing layer 59 bare formed to face each other. Accordingly, the indented portions W andX having the U shapes face each other. Further, the insulating sealingmember 52 a formed in such a manner constitutes a part of thering-shaped portion 58, and the conductive sealing member 52 bconstitutes the remaining parts of the ring-shaped portion 58. Inaddition, the first sealing layer 59 a and the second sealing layer 59 bform the junction portion 59 formed in the mutual boundary portion 12through the subsequent bonding process.

Moreover, in the present embodiment, the insulating sealing member 52 ais coated in the direction indicated by the symbol U, and the conductivesealing member 52 b is coated in the direction indicated by the symbol Vopposite to the direction indicated by the symbol U, but the inventionis not limited to this configuration. For example, the insulatingsealing member 52 a and the conductive sealing member 52 b may be coatedand formed in the same direction.

Further, in the present embodiment, as indicated by the symbols U and V,the insulating sealing member 52 a and the conductive sealing member 52b are formed in the vertical directions of the paper, but the sealingmembers 52 a and 52 b may be formed in the horizontal directions of thepaper. In any case, the insulating sealing member 52 a and theconductive sealing member 52 b are formed in the arrangement directionof the plurality of TFD formation regions 11.

Further, in the present embodiment, the line width of each of thesealing members 52 a and 52 b is uniform, but the line width may bedifferent according to a portion where each of the sealing members 52 aand 52 b is formed or a shape of the junction portion to be formed bybonding.

With such a method of forming the sealing member 52, the plurality ofTFD formation regions 11, in which the insulating sealing member 52 aand the conductive sealing member 52 b are coated and formed, are formedon the mother substrate 10′ for a TFD substrate shown in FIG. 18A. Inaddition, as shown in FIG. 18B, a part of the TFD formation region 11 isformed by the insulating sealing member 52 a and remaining parts thereofare formed by the conductive sealing member 52 b. Accordingly, thering-shaped portion 58 having the sealing members 52 a and 52 b isformed. Further, as shown in FIG. 18C, the insulating sealing member 52a and the conductive sealing member 52 b have the first sealing layer 59a and the second sealing layer 59 b which face each other at theindented portions W and X, respectively. Each of the first sealing layer59 a and the second sealing layer 59 b has symmetrical curved portions59 c. As described below, when the mother substrate 10′ for a TFDsubstrate and the mother substrate 20′ for a counter substrate arebonded to each other, the first sealing layer 59 a and the secondsealing layer 59 b are crushed and joined, such that the junctionportion 59 shown in FIG. 4 is formed.

Next, the shape sizes of the first sealing layer 59 a and the secondsealing layer 59 b will be described with reference to FIG. 18C.Hereinafter, it is defined that R2 is the radius of the curved portion59 c, d2 is the distance between central lines at a region where thefirst sealing layer 59 a and the second sealing layer 59 b are closestto each other, and w2 is the width of the sealing member 52 a or 52 bafter the bonding process. If doing so, in the present embodiment, thefollowing relationship is established.

0≦d2≦0.8×w2  Equation 15

Further, the following relationship is established.

(R2/w2)≦−1.2×(d2/w2)+2.0  Equation 16

Further, the following relationship is established.

(R2/w2)≦−(d2/w2)+1.2  Equation 17

(R2/w2)≧−0.6×(d2/w2)+0.4  Equation 18

By doing so, as verified with examples described below, even when avariation in size of the sealing member 52 a or 52 b occurs, the firstsealing layer 59 a and the second sealing layer 59 b can be reliablyjoined, thereby forming the junction portion 59. Further, the sealingmember 52 a or 52 b can be drawn at the same speed all over. Further,since a writing start portion or a writing end portion is sufficientlyseparated from the liquid crystal device, a complex control can beeliminated. Accordingly, drawing time can be markedly reduced to half toone-third of drawing time in the related art. In addition, thickening ofthe sealing member 52 a or 52 b toward the inside of the liquid crystaldevice 100 in the junction portion 59 can be solved.

Next, returning to FIGS. 14A to 14C, the method of manufacturing theliquid crystal device will be continuously described.

As shown in FIG. 14B, in a state in which the mother substrate 10′ for aTFD substrate is supplied onto the table 65 in the material supply unit63, liquid crystal 50 is dropped from the liquid droplet ejection head66. Specifically, when the table 65 is moved while turning the sealingsurface 10′a upward, liquid crystal is ejected and dropped from theliquid droplet ejection head 66, such that liquid crystal 50 is disposedat a predetermined position on the sealing surface 10′a. Liquid crystal50 is dropped in the ring-shaped portion 58 for each TFD formationregion 11.

Further, in the present embodiment, viscosity of liquid crystal to bedropped on the sealing surface 10′a of the mother substrate 10′ for aTFD substrate is preferably in a range of 130 Pa-s to 250 Pa-s. Withviscosity of liquid crystal in the above-described range, liquid crystal50 can be effectively prevented from sinking into an adhesive region ofthe sealing member 52 a or 52 b and the mother substrate 10′ for a TFDsubstrate, such that the mother substrates 10′ and 20′ can be reliablybonded to each other.

Next, as shown in FIG. 14C, the mother substrate 20′ for a countersubstrate is transported and turned over, and is loaded on the upperchuck unit 71 of the substrate bonding unit 64 by the substrateload/unload unit 62. Next, the mother substrate 20′ for a countersubstrate is held on the holding surface 71 a by the holding mechanism.

On the other hand, the mother substrate 10′ for a TFD substrate, onwhich the sealing members 52 a and 52 b and liquid crystal 50 aredisposed, is transported and loaded on the lower chuck unit 69 of thesubstrate bonding unit 64 by the substrate load/unload unit 62, and isheld on the holding surface 69 a by the holding mechanism.

In the present embodiment, the load of the mother substrate 20′ for acounter substrate on the substrate bonding unit 64 is performed prior tothe load of the mother substrate 10′ for a TFD substrate. Accordingly,in a state in which cleanliness of the sealing surfaces 10′a and 20′a ofthe mother substrate 10′ for a TFD substrate and the mother substrate20′ for a counter substrate is maintained, both mother substrates 10′aand 20′ are bonded. If the load of the mother substrate 10′ for a TFDsubstrate to be held in the lower chuck unit 69 on the substrate bondingunit 64 is performed first, when the mother substrate 20′ for a countersubstrate is loaded on the upper chuck unit 71, a foreign substance maybe accumulated onto the mother substrate 10′ for a TFD substratedisposed previously or liquid crystal 50 disposed on the sealing surface10′a.

Moreover, in the present embodiment, though the disposition process ofthe sealing members 52 a and 52 b onto the mother substrate 10′ for aTFD substrate and the disposition process of liquid crystal 50 areperformed by a single material supply unit 63, the disposition processesof the sealing members 52 a and 52 b and liquid crystal 50 may beperformed by two material supply units 63. In this case, since the twoprocesses can be performed in parallel, a throughput can be enhanced.

Further, in the present embodiment, the sealing members 52 a and 52 bare formed on the mother substrate 10′ for a TFD substrate, but thesealing members 52 a and 52 b may be formed on the mother substrate 20′of a counter substrate. In this case, each of the sealing members 52 aand 52 b is continuously and collectively formed to cover the pluralityof counter electrode formation regions 21 and the mutual boundaryportions 22. Further, in this case, the turning-over operation of themother substrate 20′ for a counter substrate by the substrateload/unload unit 62 is preferably performed just after the substrate isdischarged from the material supply unit 63. The sealing members 52 aand 52 b spread on the mother substrate 20′ for a counter substrate astime lapses after coating, such that a coating height is lowered. Inparticular, when viscosity of the sealing member 52 is equal to or lessthan 200,000 cps, the change in coating height becomes conspicuous.Accordingly, when the mother substrate 20′ for a counter substrate isturned over and held just after coating of the sealing members 52 a and52 b, the spread of the sealing members 52 a and 52 b can be suppressed,and ‘dripping’ of the sealing material can be reduced. As a result,bonding strength of the mother substrate 20′ for a counter substrate andthe mother substrate 10′ for a TFD substrate can be maintained, and thusa liquid crystal device having excellent reliability can bemanufactured.

Further, one of the sealing members 52 a and 52 b may be formed on themother substrate 10′ for a TFD substrate, and the other may be formed onthe mother substrate 20′ for a counter substrate. In this case, asdescribed above, the mother substrate 10′ for a TFD substrate and themother substrate 20′ for a counter substrate are bonded, while reducing‘dripping’ of the sealing material. Further, bonding is performed afterpositioning is performed such that the positions of the sealing members52 a and 52 b are aligned with each other.

Subsequently, as shown in FIG. 15A, the vacuum chamber 70 descends to bebrought into contact with the lower chuck unit 69, and the housing space70 b is sealed in a sealed state. After the housing space 70 b is in thesealed state, the housing space 70 b becomes substantially a vacuumstate (1.33 Pa to 1.33×10⁻² Pa) through negative-pressure suction fromthe exhaust portion 76.

After the housing space 70 b becomes substantially the vacuum state, asshown in FIG. 15B, the alignment marks (not shown) formed in the mothersubstrate 20′ for a counter substrate and the mother substrate 10′ for aTFD substrate are magnified by use of the microscopes 74 for bonding andare captured by the CCD cameras 81. Image data of the alignment markscaptured by the CCD cameras 81 is input to the image processing unit 83,and then relative positions of the mother substrate 20′ for a countersubstrate and the mother substrate 10′ for a TFD substrate are detected.The control unit 84 drives the table 68 so as to horizontally move themother substrate 20′ for a counter substrate on the basis of therelative positions detected by the image processing unit 83 andpositions the mother substrate 20′ for a counter substrate such that adeviation in relative position with respect to the mother substrate 10′for a TFD substrate is within ±10 μm.

Moreover, drawing the vacuum in the housing space 70 b and positioningof the mother substrates 10′ and 20′ may be simultaneously performed inparallel, or positioning may be performed first and then drawing thevacuum may be performed subsequently. When drawing the vacuum andpositioning are simultaneously performed, manufacturing time can bereduced.

Further, in the upper chuck unit 71, through holes 71 b are formed justbelow the microscopes 74 for bonding and the inspection windows 70 a.Via the through holes 71 b, the alignment marks of the individual mothersubstrates 10′ and 20′ are detected.

After the mother substrates 10′ and 20′ are positioned, as shown in FIG.15C, the upper chuck unit 71 descends (relative movement) by thedescending mechanism 72, such that the mother substrates 10′ and 20′facing each other are bonded to each other. In addition, the upper chuckunit 71 descends toward the lower chuck unit 69 so as to press themother substrates 10′ and 20′, such that the sealing member 52 iscompressed to a predetermined thickness.

If the mother substrates 10′ and 20′ are completely bonded to eachother, ultraviolet rays are irradiated by the UV irradiation unit 82 soas to temporarily cure the sealing member 52 and to increase viscosityof the sealing material.

Moreover, pressing after the mother substrates 10′ and 20′ are bonded toeach other may be not performed according to a manufacturing process orthe selection of the sealing members 52 a and 52 b or the like. Further,similarly, temporary curing of the sealing member 52 by the UVirradiation unit 82 may be not performed according to the sealing member52.

Further, after bonding and before precise positioning to be describedbelow, occurrence of a positional deviation of both substrates isexpected. When deviation width and direction are statistically expected,these may be offset in advance such that the positional relationship ofthe mother substrates 10′ and 20′ after the occurrence of the positionaldeviation falls within the above-described range, and the positioningmay be performed.

Subsequently, air is introduced into the housing space 70 b, and thehousing space 70 b returns from the vacuum state back to the airpressure. If the housing space 70 b of the vacuum chamber 70 is in theair pressure, both mother substrates 10′ and 20′ are pressed, such thatthe sealing member 52 is further compressed. Subsequently, holding ofthe upper chuck unit 71 and the lower chuck unit 69 is released, and, asshown in FIG. 16A, the vacuum chamber 70 ascends. Next, the substrate(in this case, the liquid crystal device 100 with the mother substrates10′ and 20′ bonded to each other) disposed on the lower chuck unit 69 ina not-held state is unloaded by the substrate load/unload unit 62.

Both mother substrates 10′ and 20′ bonded to each other is transportedto the precise alignment unit 164 by the substrate load/unload unit 62and, as shown in FIG. 16B, is loaded such that the mother substrate 20′for a counter substrate turns toward the upper chuck unit 171 and themother substrate 10′ for a TFD substrate turns toward the lower chuckunit 169. The upper chuck unit 171 and the lower chuck unit 169vacuum-attracts the mother substrate 20′ for a counter substrate and themother substrate 10′ for a TFD substrate by attraction mechanisms,respectively.

If the mother substrate 10′ for a TFD substrate and the mother substrate20′ for a counter substrate are completely held, under the air pressure,the alignment marks (not shown) formed in both mother substrates 10′ and20′ are captured by the CCD cameras 181 and 181 via the microscopes 174and 174 for alignment. Image data of the alignment marks captured by theCCD cameras 181 is input to the image processing unit 183, and therelative positions of the mother substrate 20′ for a counter substrateand the mother substrate 10′ for a TFD substrate are detected. Thecontrol unit 184 drives the table 168 so as to precisely position on thebasis of the relative positions detected by the image processing unit183 such that the deviation in relative position of the mother substrate20′ for a counter substrate and the mother substrate 10′ for a TFDsubstrate is within ±1 μm.

Further, in the upper chuck unit 171, through holes 171 b are formed atpositions just below the microscopes 174 for alignment. Via the throughholes 171 b, the alignment marks of the individual mother substrates 10′and 20′ are detected.

After both mother substrates 10′ and 20′ are precisely positioned, theupper chuck unit 171 further descends (relative movement) by thepressing mechanism 172, such that the mother substrates 10′ and 20′disposed to face each other are pressed. If doing so, the sealing member52 is further compressed, the gap control materials 52 c included in thesealing members 52 a and 52 b are brought into contact with the mothersubstrates 10′ and 20′, such that the gap between both mother substrates10′ and 20′ is adjusted to be equal to or less than about 3 μm.

Moreover, as the pressing method by the pressing mechanism 172, variouspressing methods, such as a pressing method in which pressing force isgradually increased, a pressing method in which pressing force iscontinuously increased, an S-shaped pressing method in which pressingforce at the time of pressing is temporarily maintained and thenpressing force is increased, and the like, can be used.

Further, as for regions where the upper chuck unit 171 and the lowerchuck unit 169 are brought into contact with and press the mothersubstrate 20′ for a counter substrate and the mother substrate 10′ for aTFD substrate, an entire contact surface may be pressed or only regionswhere the gap control materials 52 c included in the sealing member 52are disposed may be pressed. In a method in which only the dispositionregions of the gap control materials 52 c are pressed, regions where thegap control materials 52 c are not pressed. Accordingly, the gap betweenthe substrates due to bending of both mother substrates 10′ and 20′ canbe prevented from narrowing or constituent members by the spacersdisposed on the substrate can be prevented from being damaged.

If the gap between both mother substrates 10′ and 20′ is adjusted, theultraviolet rays are irradiated onto the sealing member 52 by the UVlamp 182, and the sealing member 52 is cured, such that the gap betweenboth mother substrates 10′ and 20′ is maintained.

Moreover, the irradiation of the UV lamp 182 may be performed just afterpressing force of the pressing mechanism 172 reaches a predeterminedpressure, or may be performed after liquid crystal 50 spreads to everyTFD formation region 11 left behind for predetermined time. That is, theirradiation can be performed with various timings. According to thematerial to be used, in order to obtain required adhesive force, aprocess of curing the sealing member may be further provided.

If the sealing members 52 a and 52 b are completely cured, the upperchuck unit 171 and the lower chuck unit 169 open sequentially orsimultaneously, and then the liquid crystal device 100 disposed on thelower chuck unit 169 in the non-held state is unloaded by the substrateload/unload unit 62.

Next, as shown in FIG. 7C, the mother substrates 10′ and 20′ are cutout, such that the manufacture of the liquid crystal device 100 iscompleted.

Moreover, in the present embodiment, the bonding process is performedaccording to the following steps [1] to [8].

[1] Set the mother substrates 10′ and 20′ on the table

[2] Draw the vacuum in the housing space 70 b

[3] Position the mother substrates 10′ and 20′

[4] Temporarily fix by UV irradiation

[5] Open the housing space 70 b to air

[6] Move to the precise alignment unit 164

[7] Precisely position the mother substrates 10′ and 20′

[8] Fix by UV irradiation

Further, the invention is not limited to this bonding process. Forexample, a bonding process according to the following steps [1] to [11]may be performed.

[1] Set the mother substrates 10′ and 20′ on the table

[2] Draw the vacuum in the housing space 70 b

[3] Descend the upper chuck unit 71 to a constant position

[4] Position the mother substrates 10′ and 20′

[5] Descend the upper chuck unit 71 further

[6] Precisely position the mother substrates 10′ and 20′

[7] Press and fix

[8] Temporarily fix by UV irradiation

[9] Turn off electrostatic chuck and ascend the upper chuck unit 71

[10] Open the housing space 70 b to air

[11] Fix by UV irradiation

In such a bonding process according to the steps [1] to [11], precisealignment is not performed in air, but the mother substrates 10′ and 20′can be reliably bonded to each other.

As described above, in the liquid crystal device 100 and the method ofmanufacturing a liquid crystal device of the present embodiment, sincethe sealing members 52 a and 52 b constitute the ring-shaped portion 58and the junction portion 59, the ring-shaped portion 58 is blocked bythe part of the junction portion 59. Therefore, leakage of the liquidcrystal layer 50 from the junction portion 59 can be suppressed, andreliability of the liquid crystal device 100 can be advanced. Further,since the junction portion 59 is formed toward the outside of thering-shaped portion 58, when the bonding process is performed, the widthof the junction portion 59 is increased only outside the ring-shapedportion 58, and thus the sealing members 52 a and 52 b can be suppressedfrom protruding inside the ring-shaped portion 58. Further, there is nocase in which a cell gap inside the ring-shaped portion 58 isinfluenced, and thus the cell gap can be uniformly maintained.

Further, as compared with the related art, the width of each member ofthe ring-shaped portion 58 and the junction portion 59 does not need tobe adjusted, and the ring-shaped portion 58 and the junction portion 59can be formed with a member having the same width, such that the sealingmembers 52 a and 52 b can be easily formed. Therefore, the dispenser canbe easily controlled, and drawing of the sealing members 52 a and 52 bcan end in short time. Further, a variation of the amount of the sealingmaterial remaining in the dispenser or a variation in viscosity betweenlots of the sealing material does not need to be regarded asquestionable, and the shapes of the sealing members 52 a and 52 b can beeasily managed.

Further, since the conductive sealing member 52 b connects theconductive pad 54 and the COM electrode 57, the liquid crystal layer 50can be held inside the ring-shaped portion 58, and the conductive pad 54and the COM electrode 57 can be connected to each other. Further, sincethe insulating sealing member 52 a is formed in the non-conductionregion on the surfaces of the relay wiring line 55 and the SEG electrode56, the liquid crystal layer 50 can be held in the ring-shaped portion58, and an electrical insulation property in the non-conduction regioncan be obtained.

Further, with the insulating sealing member 52 a and the conductivesealing member 52 b, the ring-shaped portion 58 having conductivity andan electrical insulation property can be formed, and the junctionportion 59 in which the members having conductivity and electricalinsulation property are joined can be formed. Further, in this case, thejunction portion 59 is formed between the conduction region and thenon-conduction region. However, since the junction portion 59 is formedtoward the outside of the ring-shaped portion 58, when the bondingprocess is performed, the width of the junction portion 59 is increasedonly outside the ring-shaped portion 58, and thus the sealing members 52a and 52 b can be suppressed from protruding inside the ring-shapedportion 58. Further, there is no case in which the cell gap inside thering-shaped portion 58 is influenced, and thus the cell gap can beuniformly maintained.

Further, when the relationship of Equations 15 to 18 is established, thefirst sealing layer 59 a and the second sealing layer 59 b can bereliably joined to each other, thereby forming the junction portion 59,regardless of the variation in size of the sealing members 52 a and 52b. Further, in the related art method, the sealing members 52 a and 52 bin the junction portion 59 may be thickened, and the distance of theoverlap portion needs to be increased in order to control thickening tothe minimum. Further, the control of the device may be complicated, andthen it will take a long time for drawing the sealing member. Incontrast, in the present embodiment, the sealing member 52 a and 52 bcan be drawn at the same speed all over. Further, since the writingstart portion or the writing end portion is sufficiently separated fromthe liquid crystal device, the complex control can be eliminated.Therefore, drawing time can be markedly reduced, and thickening of thesealing members 52 a and 52 b toward the inside of the liquid crystaldevice 100 in the junction portion 59 can be solved.

Further, since the liquid crystal device 100 is manufactured by bondingand cutting out the mother substrate 10′ for a TFD substrate and themother substrate 20′ for a counter substrate, a plurality of liquidcrystal devices 100 can be cut out, and thus a manufacturing methodhaving excellent productivity can be implemented.

Further, in the manufacturing method of the liquid crystal device 100,the insulating sealing member 52 a is continuously and collectivelycoated so as to cover the TFD formation regions 11 and the mutualboundary portions 12, and the conductive sealing member 52 b also iscontinuously and collectively coated. Therefore, excellent effects canbe obtained, as compared with the related art.

Specifically, with the single process from the start of drawing of theconductive sealing member 52 b to the end of drawing and the singleprocess from the start of drawing of the insulating sealing member 52 ato the end of drawing, the sealing members 52 a and 52 b arecollectively formed with respect to the arrangement direction of theplurality of TFD formation regions 11. Accordingly, the sealing members52 a and 52 b can be easily and rapidly formed, and thus a manufacturingmethod having excellent productivity can be implemented.

On the other hand, like the related art, when the sealing members 52 aand 52 b are formed for each TFD formation region 11, the start ofdrawing and the end of drawing of the sealing members 52 a and 52 bshould be performed for each TFD formation region 11, and thus the startof drawing and the end of drawing should be repeatedly performed more.Accordingly, since the ejection and the non-ejection of the sealingmaterial are continuously performed, it is difficult to cause thesealing material in the dispenser to stably flow, and the variation inthe amount of the sealing material to be ejected tends to occur.Further, since the dispenser should scan the mother substrate 10′ for aTFD substrate, the operation of the dispenser is complicated.

In contrast, in the present embodiment, since the conductive sealingmember 52 b and the insulating sealing member 52 a are continuously andcollectively formed in the arrangement direction of the TFD formationregions, the start of drawing and the end of drawing can be performedfor each column or each row of the TFD formation regions, such that thenumber of starts of drawing and the number of ends of drawing can bereduced. Accordingly, the conductive sealing member 52 b and theinsulating sealing member 52 a can be continuously and collectivelyformed, while causing the sealing material in the dispenser to stablyflow. Further, the sealing members 52 a and 52 b can be formed in shorttime. Further, since the dispenser does not scan the mother substrate10′ for a TFD substrate in the non-ejection state, the sealing materialfilled in the dispenser can be prevented from being inadvertentlydropped. As a result, the operation of the dispenser can be simplified,and the variation in viscosity of the sealing material or the variationin ejection amount can be suppressed.

Further, the sealing members 52 a and 52 b of the individual TFDformation regions 11 formed in such a method are connected to each othervia the junction portion 59, and thus leakage of liquid crystal 50 inthe mutual boundary portion 12 can be prevented.

Next, second to fourth embodiments of the method of manufacturing aliquid crystal device will be described.

In the following description, only different parts from theabove-described embodiment will be described. The same parts or the sameprocesses as those in the above-described embodiment are represented bythe same reference numerals, and the descriptions thereof will beomitted.

Second Embodiment

FIG. 19 is a diagram illustrating a manufacturing method of a liquidcrystal device according to the second embodiment of the invention.Further, FIG. 19 is a plan view illustrating a method of forming asealing member 52. In addition, FIG. 19 is a diagram showing a portionindicated by a symbol F in FIG. 18B on a magnified scale.

In the first embodiment, the first sealing layer 59 a and the secondsealing layer 59 b are configured to have the curved portions 59 c. Onthe other hand, in the present embodiment, the first sealing layer 59 aand the second sealing layer 59 b are configured to have inclinedportions 59 d. Then, as described above, when the mother substrate 10′for a TFD substrate and the mother substrate 20′ for a counter substrateare bonded to each other, the first sealing layer 59 a and the secondsealing layer 59 b are crushed and joined, such that the junctionportion 59 shown in FIG. 4 is formed.

Next, the shape sizes of the first sealing layer 59 a and the secondsealing layer 59 b will be described with reference to FIG. 19.Hereinafter, it is defined that c2 is the chamfered amount of theinclined portion 59 d, d2 is the distance between the central lines in aregion where the first sealing layer 59 a and the second sealing layer59 b is closest to each other, and w2 is the width of the sealing member52 a or 52 b after the bonding process. If doing so, in the presentembodiment, the following relationship is established.

0≦d2≦0.8×w2  Equation 19

Further, the following relationship is established.

(c2/w2)≦−0.5×(d2/w2)+1.2  Equation 20

Further, the following relationship is established.

(c2/w2)≦−0.5×(d2/w2)+0.7  Equation 21

(c2/w2)≧−0.5×(d2/w2)+0.3  Equation 22

By doing so, as verified with examples described below, even when thevariation in size of the sealing member 52 a or 52 b occurs, the firstsealing layer 59 a and the second sealing layer 59 b can be reliablyjoined, thereby forming the junction portion 59. Further, the sealingmember 52 a or 52 b can be drawn at the same speed all over. Further,since the writing start portion or the writing end portion issufficiently separated from the liquid crystal device, the complexcontrol can be eliminated. Accordingly, drawing time can be markedlyreduced to half to one-third of drawing time in the related art. Inaddition, thickening of the sealing member 52 a or 52 b toward theinside of the liquid crystal device 100 in the junction portion 59 canbe solved.

Third Embodiment

FIG. 20 is a diagram illustrating a manufacturing method of a liquidcrystal device according to a third embodiment of the invention.Further, FIG. 20 is a plan view showing respective constituent parts ofthe liquid crystal device as viewed from the counter substrate. FIG. 21is a plan view showing a region indicated by a symbol C of FIG. 20 on amagnified scale. FIG. 22 is a plan view specifically illustrating theconfiguration of the sealing member.

As shown in FIGS. 20 to 22, in the liquid crystal device 100 of thepresent embodiment, the insulating sealing member (second sealingmember) 52 a is linearly formed in a vertical direction of the paper.Further, at points O and R, the insulating sealing member 52 a and theconductive sealing member (first sealing member) 52 b are connected toeach other.

Further, the insulating sealing member 52 a and the conductive sealingmember 52 b are formed in a pattern shown in FIG. 22, and thus a singlering-shaped portion 58 that holds the liquid crystal layer 50 thereinand a junction portion 59 in which the insulating sealing member 52 aand the conductive sealing member 52 b are joined are configured. Thesealing member 52 formed in such a pattern is a formed in a closed boxshape in a region on the surface of the TFD substrate 10, with no liquidcrystal injection hole.

In the ring-shaped portion 58, the insulating sealing member 52 a isformed to pass through points R and O in FIG. 22, and the conductivesealing member 52 b is formed to pass through points O, P, Q, and R inFIG. 22.

In the junction portion 59, the insulating sealing member 52 a and theconductive sealing member 52 b are joined at the points O and R.Therefore, the junction portions 59 are formed at a place on an end ofthe side OP and at a place on an end of the side QR. That is, thejunction portions 59 are individually formed on opposite sides of thering-shaped portion 58.

Further, the junction portions 59 are formed so as to be continuous withrespect to the ring-shaped portion 58 and block the ring-shaped portion58 at the points O and R. Accordingly, the liquid crystal layer 50 heldinside the ring-shaped portion 58 can be prevented from leaking outsidethe sealing member 52. Further, at the points O and R, parts of theindividual junction portions 59 are integrated into the ring-shapedportion 58, and the other parts of the individual junction portions 59are formed outside the ring-shaped portion 58. That is, the junctionportions 59 are formed toward the outside of the ring-shaped portion 58from the portions for blocking the ring-shaped portion 58 (points O andR). Therefore, the junction portions 59 are not formed to overlap thering-shaped portion 58. Only the parts of the individual junctionportions 59 join the ring-shaped portion 58 and the other parts thereofare formed toward the outside of the ring-shaped portion 58.

Further, as shown in FIG. 21, the junction portion 59 is formed betweenan end (symbol A) of the conductive pad 54 and an end (symbol B) of therelay wiring line 55 crossing the sealing member 52, that is, in aportion indicated by a symbol L. In the liquid crystal device 100 of thepresent embodiment, the distance of the symbol L is set to be equal toor less than 2 mm.

Further, as described below, the junction portions 59 are formed bydrawing the insulating sealing member 52 a and the conductive sealingmember 52 b from the dispenser in the non-contact state to face eachother, and then pressing the sealing members 52 a and 52 b through thebonding process so as to contact and to be joined.

Next, a method of manufacturing a liquid crystal device according to thepresent embodiment will be described.

FIGS. 23A and 23B are plan views illustrating a method of forming thesealing member 52. FIGS. 24A to 24C are plan views showing the sealingmember 52 formed on the mother substrate. Specifically, FIG. 24A is adiagram showing the appearance of the mother substrate, FIG. 24B is adiagram showing a portion indicated by a symbol E of FIG. 24A on amagnified scale, and FIG. 24C is a diagram showing a portion indicatedby a symbol F of FIG. 24B on a magnified scale.

As shown in FIG. 23A, the insulating sealing member 52 a is coated onthe mother substrate 10′ for a TFD substrate in a direction indicated bya symbol U (second sealing member forming process). Here, as describedabove, the plurality of TFD formation regions 11 and the mutual boundaryportions 12 are formed on the mother substrate 10′ for a TFD substrate,and then the insulating sealing member 52 a is continuously andcollectively coated to cover the TFD formation regions 11 and the mutualboundary portions 12. Further, the direction indicated by the symbol Urepresents the same direction as the arrangement direction of theplurality of TFD formation regions 11.

Here, when the insulating sealing member 52 a is coated and formed, afirst side 58 a, which is a part of the ring-shaped portion 58, isformed on a lateral side of the TFD formation region 11. Further, in themutual boundary portion 12, a first sealing layer 59 a, which is formedso as to be continuous with respect to the first side 58 a, is formed.Here, the first sealing layer 59 a is formed on a coaxial straight line(symbol U) to the first side 58 a in the mutual boundary portion 12.

Next, as shown in FIG. 23B, the conductive sealing member 52 b is coatedon the mother substrate 10′ for a TFD substrate in a direction indicatedby a symbol V (first sealing member forming process). In this process,like the insulating sealing member 52 a, the conductive sealing member52 b is continuously and collectively coated to cover the plurality ofTFD formation regions 11 and the mutual boundary portions 12. Further,the direction indicated by the symbol V represents the same direction asthe arrangement direction of the plurality of TFD formation regions 11.

Here, when the conductive sealing member 52 b is coated and formed, asecond side 58 b, which is a part of the ring-shaped portion 58, isformed in an axis direction perpendicular to the extended axis (symbolV) of the first side 58 a, and a third side 58 c is formed on a lateralside of the TFD formation region 11 to face the first side 58 a.Further, in the mutual boundary portion 12, a second sealing layer 59 b,which is formed so as to be continuous with respect to the second side58 b, is formed. Here, the second sealing layer 59 b is formed in anindented portion X which is indented toward the TFD formation region 11from an extended axis direction of the third side 58 c in the mutualboundary portion 12. The indented portion X is in a so-called ‘U’ shape.

Further, the first sealing layer 59 a and the second sealing layer 59 bare formed to face each other. Accordingly, the first sealing layer 59 aformed on the coaxial straight line to the first side 58 a and theindented portion X having the U shape face each other. Further, theinsulating sealing member 52 a formed in such a manner constitutes apart of the ring-shaped portion 58, and the conductive sealing member 52b constitutes the remaining parts of the ring-shaped portion 58. Inaddition, the first sealing layer 59 a and the second sealing layer 59 bform the junction portion 59 formed in the mutual boundary portion 12through the subsequent bonding process.

With such a method of forming the sealing member 52, the plurality ofTFD formation regions 11, in which the insulating sealing member 52 aand the conductive sealing member 52 b are coated and formed, are formedon the mother substrate 10′ for a TFD substrate shown in FIG. 24A. Inaddition, as shown in FIG. 24B, a part of the TFD formation region 11 isformed by the insulating sealing member 52 a and remaining parts thereofare formed by the conductive sealing member 52 b. Accordingly, thering-shaped portion 58 having the sealing members 52 a and 52 b isformed. Further, as shown in FIG. 24C, the insulating sealing member 52a and the conductive sealing member 52 b have the first sealing layer 59a and the second sealing layer 59 b which face each other, respectively.Next, when the mother substrate 10′ for a TFD substrate and the mothersubstrate 20′ for a counter substrate are bonded to each other, thefirst sealing layer 59 a and the second sealing layer 59 b are crushedand joined, such that the junction portion 59 shown in FIG. 22 isformed.

Next, the shape sizes of the first sealing layer 59 a and the secondsealing layer 59 b will be described with reference to FIG. 24C.Hereinafter, it is defined that R1 is the radius of the curved portion59 c, d1 is the distance between the central lines at the region wherethe first sealing layer 59 a and the second sealing layer 59 b areclosest to each other, and w1 is the width of the sealing member 52 a or52 b after the bonding process. If doing so, in the present embodiment,the following relationship is established.

0≦d1≦0.8×w1  Equation 23

Further, the following relationship is established.

(R1/w1)≦−2.0×(d1/w1)+3.0  Equation 24

Further, the following relationship is established.

(R1/w1)≦−1.7×(d1/w1)+2.0  Equation 25

(R1/w1)≧−1.2×(d1/w1)+1.0  Equation 26

By doing so, as verified with examples described below, even when avariation in size of the sealing member 52 a or 52 b occurs, the firstsealing layer 59 a and the second sealing layer 59 b can be reliablyjoined, thereby forming the junction portion 59. Further, the sealingmember 52 a or 52 b can be drawn at the same speed all over. Further,since the writing start portion or the writing end portion issufficiently separated from the liquid crystal device, the complexcontrol can be eliminated. Accordingly, drawing time can be markedlyreduced to half to one-third of drawing time in the related art. Inaddition, thickening of the sealing member 52 a or 52 b toward theinside of the liquid crystal device 100 in the junction portion 59 canbe solved.

Further, since the first sealing layer 59 a and the first side 58 a areformed, drawing time can be reduced, as compared with a case in whichthe first sealing layer 59 a is formed while drawing a curve or aninclined line.

Fourth Embodiment

FIG. 25 is a diagram illustrating a manufacturing method of a liquidcrystal device according to the fourth embodiment of the invention.Further, FIG. 25 is a plan view illustrating a method of forming asealing member 52. In addition, FIG. 25 is a diagram showing a portionindicated by the symbol F in FIG. 18B on a magnified scale.

In the third embodiment, the second sealing layer 59 b is configured tohave the curved portion 59 c. On the other hand, in the presentembodiment, the second sealing layer 59 b is configured to have aninclined portion 59 d. Then, as described above, when the mothersubstrate 10′ for a TFD substrate and the mother substrate 20′ for acounter substrate are bonded to each other, the first sealing layer 59 aand the second sealing layer 59 b are crushed and joined, such that thejunction portion 59 shown in FIG. 22 is formed.

Next, the shape sizes of the first sealing layer 59 a and the secondsealing layer 59 b will be described with reference to FIG. 25.Hereinafter, it is defined that c1 is the chamfered amount of theinclined portion 59 d, d1 is the distance between the central lines inthe region where the first sealing layer 59 a and the second sealinglayer 59 b is closest to each other, and w1 is the width of the sealingmember 52 a or 52 b after the bonding process. If doing so, in thepresent embodiment, the following relationship is established.

0≦d1≦0.8×w1  Equation 27

Further, the following relationship is established.

(c1/w1)≦−0.5×(d1/w1)+1.2  Equation 28

Further, the following relationship is established.

(c1/w1)≦−0.5×(d1/w1)+0.7  Equation 29

(c1/w1)≧−0.5×(d1/w1)+0.3  Equation 30

By doing so, as verified with examples described below, even when thevariation in size of the sealing member 52 a or 52 b occurs, the firstsealing layer 59 a and the second sealing layer 59 b can be reliablyjoined, thereby forming the junction portion 59. Further, the sealingmember 52 a or 52 b can be drawn at the same speed all over. Further,since the writing start portion or the writing end portion issufficiently separated from the liquid crystal device, the complexcontrol can be eliminated. Accordingly, drawing time can be markedlyreduced to half to one-third of drawing time in the related art. Inaddition, thickening of the sealing member 52 a or 52 b toward theinside of the liquid crystal device 100 in the junction portion 59 canbe solved.

Moreover, in the present embodiment, the inclined portions 59 d areformed according to the chamfered amounts c1 and c2. That is, theinclined portion 59 d is formed to be inclined at 45 degrees withrespect to the central line direction of the second sealing layer 59 b.The invention is not limited to this configuration, in which theinclined portion 59 d is formed at 45 degrees. For example, the inclinedportion 59 d may be formed to an acute angle or an obtuse angle from 45degrees.

Further, in the present embodiment, the sizes of the sealing members 52a and 52 b are the same, but the sizes may be different from each other.The conductive sealing member 52 b may be larger than the insulatingsealing member 52 a. For example, the insulating sealing member 52 a maybe 0.5 mm and the conductive sealing member 52 b may be 0.7 mm.

Next, fifth to ninth embodiments of the liquid crystal device will bedescribed.

In the following description, only different parts from theabove-described embodiments will be described. The same parts as thosein the above-described embodiments are represented by the same referencenumerals, and the descriptions thereof will be omitted. Moreover, theliquid crystal devices of the fifth to ninth embodiments aremanufactured by use of the manufacturing method of any one of the firstto fourth embodiments.

Fifth Embodiment

First, the liquid crystal device according to the fifth embodiment ofthe invention will be described.

FIG. 26 is a plan view showing respective constituent parts of theliquid crystal device according to the present embodiment as viewed fromthe counter substrate. In the present embodiment, it is configured suchthat the conductive sealing member 52 b is formed between the imagedisplay region 4 and the scanning signal driving circuit 110, and theinsulating sealing member 52 a is formed on an opposite side to theconductive sealing member 52 b via the junction portion 59. That is, ascompared with the first embodiment, the positions of the insulatingsealing member 52 a and the conductive sealing member 52 b are inverted.

Further, in the TFD substrate 10, the conductive pad 54 is formed on alateral side of the data signal driving circuit 120 and is connected tothe data signal driving circuit 120 via the relay wiring lines 55. Onthe other hand, in the counter substrate 20, the COM electrodes 57 areformed outside of the image display region 4 and extend toward theconductive pad 54. Then, the conductive sealing member 52 b isinterposed between the COM electrodes 57 and the conductive pad 54, suchthat the conductive particles electrically connect the COM electrodes 57and the conductive pad 54. Here, since the conductive sealing member 52b is formed on wiring lines of the SEG electrodes 56, the conductivesealing member 52 b is configured in consideration of the electricalshort-circuit of the wiring lines of the SEG electrodes 56 to adjacentwiring lines.

As such, when the conductive sealing member 52 b is formed between theimage display region 4 and the scanning signal driving circuit 110, thesame effects as those in the above-described embodiments can beobtained.

Sixth Embodiment

Next, a liquid crystal device according to the sixth embodiment of theinvention will be described.

FIG. 27 is a plan view of respective constituent parts of the liquidcrystal device according to the present embodiment as viewed from thecounter substrate. Like the fifth embodiment, in the present embodiment,it is configured such that the conductive sealing member 52 b is formedbetween the image display region 4 and the scanning signal drivingcircuit 110, and the insulating sealing member 52 a is formed on anopposite side to the conductive sealing member 52 b via the junctionportion 59.

Further, unlike the first to fifth embodiments, in the presentembodiment, the scanning signal driving circuit 110 and the data signaldriving circuit 120 are formed in the counter substrate 20. Therefore,the scanning signal driving circuit 110 is connected to the SEGelectrodes 56 via the conductive pad 54.

Accordingly, in the counter substrate 20, the conductive pad 54 isformed on the lateral side of the scanning signal driving circuit 110and is connected to the scanning signal driving circuit 110 via relaywiring lines 60. Further, the data signal driving circuit 120 isconnected to the pixel electrodes 9 via the COM electrodes 57. On theother hand, in the TFD substrate 10, the SEG electrodes are formedoutside the image display region 4 and extend toward the conductive pad54. Then, the conductive sealing member 52 b is interposed between theSEG electrodes 56 and the conductive pad 54, such that the conductiveparticles electrically connect the SEG electrodes 56 and the conductivepad 54. Here, since the conductive sealing member 52 b is formed onwiring lines of the COM electrodes 57, the conductive sealing member 52b is configured in consideration of the electrical short-circuit of thewiring lines of the COM electrodes 57 to adjacent wiring lines.

As such, when the conductive sealing member 52 b is formed between theimage display region 4 and the scanning signal driving circuit 110, thesame effects as those in the above-described embodiments can beobtained.

Moreover, the liquid crystal device of each of the first to sixthembodiments is an active matrix type in which the TFD element 40 is usedas a switching element, but the invention is not limited to the activematrix-type liquid crystal device. For example, the invention can beapplied to a passive-type liquid crystal device.

Seventh Embodiment

Next, a liquid crystal device according to the seventh embodiment of theinvention will be described.

The liquid crystal device of the present embodiment is an activematrix-type liquid crystal device in which a thin film transistor(hereinafter, referred to as TFT) is used as a switching element. FIG.28 is a plan view showing respective constituent parts of the liquidcrystal device according to the present embodiment as viewed from thecounter substrate.

Here, in the liquid crystal device having the TFD of each of the firstto sixth embodiment, a potential is applied from the SEG electrode 56 ofthe TFD substrate 10 to the pixel electrode 31, and a potential isapplied from the COM electrode 57 to the pixel electrode 9, such that avoltage is applied to the liquid crystal layer 50 between the pixelelectrodes 31 and 9. That is, the TFD is a two-terminal element.

On the other hand, in the liquid crystal device having the TFT of thepresent embodiment, a potential is applied to a pixel electrode bysignals, which are applied to a data line and a gate line formed in aTFT substrate, and a voltage, which is generated between the pixelelectrode and a counter substrate formed on an entire surface, isapplied to the liquid crystal layer 50. That is, the TFT is athree-terminal element.

As shown in FIG. 28, the liquid crystal device 101 has, on the TFTsubstrate 102, data relay wiring lines 85, gate relay wiring lines 86,an insulating sealing member 52 a, a conductive sealing member 52 b, anddot conductive portions (first conductive portions or conductiveregions) 87. Here, the insulating sealing member 52 a is formed on aleft side from a portion indicated by a symbol Y, and the conductivesealing member 52 b is formed on a right side from the portion indicatedby the symbol Y. Then, the liquid crystal layer 50 is held inside aring-shaped portion 58 surrounded by the sealing members 52 a and 52 b,such that the image display region 4 is formed. Further, a junctionportion 59 is formed on a line of the symbol Y. In addition, theconductive sealing member 52 b extends on the dot conductive portions87. That is, when the TFT substrate 102 and the counter substrate arebonded to each other, the TFT substrate 102 is electrically connected tothe counter substrate via the dot conductive portions 87.

As such, in the liquid crystal device 101 using the TFT, the conductivesealing member 52 b is formed on the dot conductive portions 87, andthus the dot seals for the connection of the upper and lower substratesin the related art do not need to be provided.

Modification of Seventh Embodiment

FIG. 29 is a diagram showing a modification of the seventh embodiment.Specifically, FIG. 29 is a plan view showing respective constituentparts of a liquid crystal device as viewed from the counter substrate.

In the present modification, as shown in FIG. 29, the gate relay wiringlines 86 are formed on one side of the image display region 4.

In such a configuration, the same effects as those in the seventhembodiment can be obtained.

Eighth Embodiment

Next, a liquid crystal device according to the eighth embodiment of theinvention will be described.

FIG. 30 is a plan view showing respective constituent parts of theliquid crystal device according to the present embodiment as viewed fromthe counter substrate. Further, the liquid crystal device of the presentembodiment has the TFT, like the seventh embodiment.

As shown in FIG. 30, in the liquid crystal device 101, in thering-shaped portion 58, the insulating sealing member 52 a and theconductive sealing member 52 b have the same length. Further, otherparts are the same as those in the seventh embodiment. Specifically, thejunction portion 59 is substantially disposed at a center of one side ofthe ring-shaped portion 58. The conductive sealing member 52 b is formedon a right side from a portion indicated by a symbol Z, and theinsulating sealing member 52 a is formed on a left side from the portionindicated by the symbol Z. Accordingly, the insulating sealing member 52a and the conductive sealing member 52 b have the same length.

In such a configuration, when each of the sealing members 52 a and 52 bis drawn by a separate dispenser, tack time of the apparatus can bearranged, and the liquid crystal device 101 can be efficiently produced.Further, the TFT substrate 102 and the counter substrate areelectrically connected by the conductive sealing member 52 b formed onthe dot conductive portions 87.

Moreover, the fifth to eighth embodiments relate to the liquid crystaldevice manufactured by use of the manufacturing method of the first orsecond embodiment. Specifically, the first sealing layer 59 a is formedon the central line different from the axis along which the first side58 a of the ring-shaped portion 58 extends, and the second sealing layer59 b is formed to face the first sealing layer 59 a. The fifth to eighthembodiments are not limited to the liquid crystal device formed by sucha manufacturing method, but may relate to the liquid crystal devicemanufactured by use of the manufacturing method of the third or fourthembodiment. Specifically, the first side 58 a of the ring-shaped portion58 and the first sealing layer 59 a may be formed on the same straightline, and the second sealing layer 59 b may be formed to face the firstsealing layer 59 a.

Ninth Embodiment

Next, a liquid crystal device according to a ninth embodiment of theinvention will be described.

FIG. 31 is a plan view showing respective constituent parts of theliquid crystal device according to the present embodiment as viewed fromthe counter substrate. Further, the liquid crystal device of the presentembodiment has the TFT, like the seventh embodiment. In addition, theliquid crystal device of the present embodiment can be used for a largedisplay, such as a large television or the like.

As shown in FIG. 31, a liquid crystal device 103 has a single sealingmember 52. Specifically, though the sealing member 52 is formed by theconductive sealing member and the insulating sealing member in the firstto eighth embodiments, in the present embodiment, the sealing member isformed by the insulating sealing member.

Further, in the liquid crystal device 103, the ring-shaped portion 58has the liquid crystal layer 50 therein, and the junction portion 59blocks the ring-shaped portion 58 at one place. The ring-shaped portion58 and the junction portion 59 are continuously and collectively formed.The ring-shaped portion 58 and the junction portion 59 are formed bycoating the sealing member 52 with so-called one stroke of a brush. Thatis, the sealing member 52 is formed from one end of the single member tothe other end and forms the junction portion 59 by joining one end andthe other end. In addition, the liquid crystal layer 50 is held insidethe ring-shaped portion 58 surrounded by the single member. Here, thejunction portion 59 is formed toward the outside of the ring-shapedportion 58, not to overlap the path of the ring-shaped portion 58.

Further, the dot conductive portions 87 are formed of conductive membersdifferent from the sealing member 52, and the TFT substrate 102 and thecounter substrate can be electrically connected via the dot conductiveportions 87.

If doing so, since the ring-shaped portion 58 is blocked by the junctionportion 59 in which one end of the sealing member 52 and the other endthereof are joined at one place, the number of junction portions 59 isminimized. Therefore, as compared with a case in which a plurality ofjunction portions 59 are provided, a liquid crystal device, in which adefective cell gap is reliably suppressed, can be implemented. Inaddition, since the junction portion 59 is formed toward the outside ofthe ring-shaped portion 58, when the bonding process is performed, thewidth of the junction portion 59 is increased only outside thering-shaped portion 58, and thus the sealing member 52 can be suppressedfrom protruding inside the ring-shaped portion 58. Further, there is nocase in which the cell gap inside the ring-shaped portion 58 isinfluenced, and thus the cell gap can be uniformly maintained.

EXAMPLES

Next, an example of the invention will be described.

In the present example, for the shapes of the first and second sealinglayers 59 a and 59 b of <1> to <4> described below, the measurementresults of reliability of a panel (liquid crystal device), the shape ofthe junction portion 59 formed by the bonding process, the ratio of thehollow depth and the width of the sealing member, and the panel stateare shown.

<1> When the first and second sealing layers 59 a and 59 b have thecurved portions 59 c at the indented portions W and X (FIG. 18C, FirstEmbodiment)

<2> When the first and second sealing layers 59 a and 59 b have theinclined portions 59 d at the indented portions W and X (FIG. 19, SecondEmbodiment)

<3> When the first side 58 a of the ring-shaped portion 58 and the firstsealing layer 59 a are the straight lines, and the second sealing layer59 b has the curved portion 59 c (FIG. 24C, Third Embodiment)

<4> When the first side 58 a of the ring-shaped portion 58 and the firstsealing layer 59 a are the straight lines, and the second sealing layer59 b has the inclined portion 59 d (FIG. 25, Fourth Embodiment)

<1> When the first and second sealing layers 59 a and 59 b have thecurved portions 59 c at the indented portions W and X (FIG. 18C, FirstEmbodiment)

Table 1 shows the examination result of the panel for the shapes of thefirst and second sealing layers 59 a and 59 b in the first embodiment.

TABLE 1 w2 R2 d2 h2 h2/w2 RELIABILITY Δ x 0.5 mm  0.4 mm 0.2 mm 0.23 mm0.47 ∘ 0% 0% 0.5 mm  0.5 mm 0.2 mm 0.30 mm 0.60 Δ 1% 0% 0.5 mm 0.75 mm0.2 mm 0.47 mm 0.95 Δ 6% 0% 0.5 mm  0.8 mm 0.2 mm 0.51 mm 1.02 x 8% 2%0.7 mm  0.3 mm 0.5 mm 0.30 mm 0.43 ∘ 0% 0% 0.7 mm 0.45 mm 0.5 mm 0.41 mm0.59 Δ 1% 0% 0.7 mm 0.75 mm 0.5 mm 0.64 mm 0.92 Δ 4% 0% 0.7 mm  0.9 mm0.5 mm 0.76 mm 1.09 x 6% 1%

In Table 1, w2 is the width of the sealing member after bonding, R2 isthe radius of the curved portion 59 c, d2 is the distance between thecentral lines of the sealing members, and h2 is the hollow depth fromthe inside of the ring-shaped portion 58 to the indented portion of thejunction portion 59 (FIG. 32). That is, R2 and d2 are parameters of apattern shape when the sealing member is drawn, and w2 and h2 areparameters obtained by performing the bonding process. Further, Table 1shows the evaluation results obtained under an atmosphere of 60° C., 90%RH for 1000 hours. Further, in a column of reliability, ‘◯’ meansfavorable with no change, ‘Δ’ represents that a slight change inthreshold value is recognized, but within a tolerance range, and ‘x’means that occurrence of irregularity of a defective level isrecognized.

From the results of Table 1, it was confirmed the reliability isinfluenced by the ratio h2/w2 of the hollow depth h2 and the width ofthe sealing member w2, without depending on the width w2 of the sealingmember, the radius R2 of the curved portion 59 c, and the distance d2between the central lines of the sealing members. Then, it was confirmedthat, when h2/w2 is equal to or less then 1.0, a defect does not occurand, when h2/w2 is equal to or less than 0.5, irregularity is notrecognized at all.

Table 2 shows the examination results of the shape of the junctionportion 59 formed by the bonding process for the shapes of the first andsecond sealing layers 59 a and 59 b in the first embodiment.

TABLE 2 CONVEX OF JUNCTION W2 R2 d2 h2 h2/w2 PORTION Δ x 0.5 mm   0 mm  0 mm 0.00 mm 0.00 Δ 4% 0% 0.5 mm  0.2 mm   0 mm 0.05 mm 0.09 Δ 1% 0%0.5 mm 0.05 mm 0.25 mm 0.06 mm 0.11 ∘ 0% 0% 0.7 mm   0 mm  0.1 mm 0.01mm 0.01 Δ 0% 0% 0.7 mm  0.3 mm   0 mm 0.07 mm 0.10 ∘ 0% 0% 0.7 mm 0.15mm  0.2 mm 0.07 mm 0.10 ∘ 0% 0% 0.7 mm   0 mm  0.4 mm 0.06 mm 0.09 Δ 1%0%

In Table 2, w2 is the width of the sealing member after bonding, R2 isthe radius of the curved portion 59 c, d2 is the distance between thecentral lines of the sealing members, and h2 is the hollow depth of thejunction portion 59 (FIG. 32). Further, in a column of ‘convex ofjunction portion’, ‘◯’ means that the convex is formed but favorable,‘Δ’ means that the convex is formed but does not become a defectivelevel, and ‘x’ means that the swelled amount of the convex exceeds twotimes of the size of the sealing member, that is, the defective level.Moreover, in general, it is known that, when the sealing member iscoated and formed with the dispenser, the size of the sealing member isvaried by about 10%. As a result, even when the average of h2/w2 is0.09, that is, even when the junction portion 59 averagedly has aindented shape, there is a case in which the junction portion 59 doesnot have the indented shape, but is swelled (FIG. 33) not more than 1%.The swelled amount is the maximum when w2 is 0.5 mm, R2 is 0 mm, and d2is 0 mm, but it is equal to or less than 20 percent with respect to thewidth of the sealing member, and thus it does not matter practically.However, in order to completely eliminate the convex of the junctionportion 59 including the variation in the seal size, it was confirmedthat it is preferable to set h2/w2 to be equal to or less than 0.1.

Table 3 shows the examination results of the ratio h2/w2 of the hollowdepth h2 and the width w2 of the sealing member, and the panel state forthe shapes of the first and sealing layers 59 a and 59 b in the firstembodiment, when the width w2 of the sealing member after bonding isfixed to 0.5 mm, and the radius R2 of the curved portion 59 c and thedistance d2 between the central lines of the sealing members arechanged.

In Table 3, in a *1 portion, the ratio h2/w2 of the hollow depth h2 ofthe junction portion 59 and the width w2 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h2/w2 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d2/w2 exceeds 0.9, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 3, d2/w2 and R2/w2 of a boundary where reliability canbe ensured and a boundary where the convex occurs in the junctionportion are plotted to be substantially on straight lines, as shown inFIG. 35. Here, the values of R2/w2 when h2/w2 serving as the boundarybecomes 0.1, 0.5, and 1.0 were calculated by interpolation.

Next, Table 4 shows the examination results of the ratio h2/w2 of thehollow depth h2 and the width w2 of the sealing member, and the panelstate for the shapes of the first and sealing layers 59 a and 59 b inthe first embodiment, when the width w2 of the sealing member afterbonding is fixed to 0.7 mm, and the radius R2 of the curved portion 59 cand the distance d2 between the central lines of the sealing members arechanged.

In Table 4, in a *1 portion, the ratio h2/w2 of the hollow depth h2 ofthe junction portion 59 and the width w2 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h2/w2 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d2/w2 exceeds 0.85, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 4, when d2/w2 and R2/w2 of the boundary wherereliability can be ensured and the boundary where the convex occurs inthe junction portion are plotted to be substantially on straight lines,as shown in FIG. 36.

Here, in a case in which the width w2 of the sealing member is 0.5 mmand 0.7 mm, for the boundary where reliability can be ensured and theboundary where the convex occurs in the junction portion, on the samegraph, the boundaries of d2/w2 and R2/w2 (FIGS. 35 and 36) are plottedas shown in FIG. 37.

As shown in FIG. 37, when the width w2 of the sealing member afterbonding is 0.5 mm or 0.7 mm, the boundaries are on the same line.Therefore, even when w2 is out of the above-described range, theboundaries are on the line of FIG. 37.

From FIG. 37, it can be seen that the relationship of d2/w2 and R2/w2 isplotted to be on the same line, without depending on the width of thesealing member.

As such, in order to ensure reliability, without depending on the sizeof the sealing member, the following condition is satisfied.

(R2/w2)≦−1.2×(d2/w2)+2.0  Equation 31

Ideally, the following condition is to be satisfied.

(R2/w2)≦−(d2/w2)+1.2  Equation 32

Further, the convex (thickening) of the sealing member in the junctionportion is less than 20 percent for the width of the sealing member,which does not matter practically. However, in order to completelyeliminate the convex of the junction portion including the variation insize of the sealing member, ideally, it is preferable that the followingcondition is satisfied.

(R2/w2)≧−0.6×(d2/w2)+0.4  Equation 33

In addition, in order to prevent the sealing members from being notbrought into contact with each other and to prevent liquid crystal fromleaking due to the variation in size of the sealing member in thejunction portion, ideally, it is preferable that the following conditionis satisfied.

d2/w2≦0.8  Equation 34

As described above, by defining the shapes of the first and secondsealing layers 59 a and 59 b, the same effects as those in theabove-described embodiments can be obtained. On the other hand, in therelated art, the sealing member in the junction portion may bethickened, and the distance of the overlap portion needs to be increasedin order to control thickening to the minimum. Further, the control ofthe device may be complicated, and then it will take a long time fordrawing the sealing member. In contrast, in the method of the presentexample, the sealing member can be drawn at the same speed all over.Further, since the writing start portion or the writing end portion issufficiently separated from the panel, the complex control can beeliminated. Accordingly, drawing time can be markedly reduced to half toone-third of drawing time in the related art. In addition, thickening ofthe sealing member toward the inside of the liquid crystal device in thejunction portion of the sealing member can be solved.

<2> When the first and second sealing layers 59 a and 59 b have theinclined portions 59 d at the indented portions W and X (FIG. 19, SecondEmbodiment)

Table 5 shows the examination results of the ratio h2/w2 of the hollowdepth h2 and the width w2 of the sealing member, and the panel state forthe shapes of the first and sealing layers 59 a and 59 b in the secondembodiment, when the width w2 of the sealing member after bonding isfixed to 0.5 mm, and the chamfered amount c2 of the inclined portion 59d and the distance d2 between the central lines of the sealing membersare changed.

In Table 5, in a *1 portion, the ratio h2/w2 of the hollow depth h2 ofthe junction portion 59 and the width w2 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h2/w2 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d2/w2 exceeds 0.9, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 5, d2/w2 and c2/w2 of the boundary where reliabilitycan be ensured and the boundary where the convex occurs in the junctionportion are plotted to be substantially on straight lines, as shown inFIG. 38. Here, the values of c2/w2 when h2/w2 serving as the boundarybecomes 0.5 and 1.0 were calculated by interpolation.

Next, Table 6 shows the examination results of the change of hollowdepth h2 and the panel state for the shapes of the first and sealinglayers 59 a and 59 b in the second embodiment, when the width w2 of thesealing member after bonding is fixed to 0.7 mm, and the chamferedamount c2 of the inclined portion 59 d and the distance d2 between thecentral lines of the sealing members are changed.

In Table 6, in a *1 portion, the ratio h2/w2 of the hollow depth h2 ofthe junction portion 59 and the width w2 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h2/w2 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d2/w2 exceeds 0.85, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 6, when d2/w2 and R2/w2 of the boundary wherereliability can be ensured and the boundary where the convex occurs inthe junction portion are plotted to be substantially on straight lines,as shown in FIG. 39. Here, the values of c2/w2 when h2/w2 serving as theboundary is 0.1, 0.5, and 1.0 were calculated by interpolation.

Here, in a case in which the width w2 of the sealing member is 0.5 mmand 0.7 mm, for the boundary where reliability can be ensured and theboundary where the convex occurs in the junction portion, on the samegraph, the boundaries of d2/w2 and c2/w2 (FIGS. 38 and 39) are plottedas shown in FIG. 37.

As shown in FIG. 40, when the width w2 of the sealing member afterbonding is 0.5 mm or 0.7 mm, the boundaries are on the same line.Therefore, even when w2 is out of the above-described range, theboundaries are on the line of FIG. 40.

From FIG. 40, it can be seen that the relationship of d2/w2 and c2/w2 isplotted to be on the same line, without depending on the width of thesealing member.

As such, in order to ensure reliability, without depending on the sizeof the sealing member, the following condition is satisfied.

(c2/w2)≦−0.5×(d2/w2)+1.2  Equation 35

Ideally, the following condition is to be satisfied.

(c2/w2)≦−0.5×(d2/w2)+0.7  Equation 36

Further, the convex (thickening) of the sealing member in the junctionportion is less than 20 percent for the width of the sealing member,which does not matter practically. However, in order to completelyeliminate the convex of the junction portion including the variation insize of the sealing member, ideally, it is preferable that the followingcondition is satisfied.

(c2/w2)≧−0.5×(d2/w2)+0.3  Equation 37

In addition, in order to prevent the sealing members from being notbrought into contact with each other and to prevent liquid crystal fromleaking due to the variation in size of the sealing member in thejunction portion, ideally, it is preferable that the following conditionis satisfied.

d2/w2≦0.8  Equation 38

As described above, by defining the shapes of the first and secondsealing layers 59 a and 59 b, the same effects as those in theabove-described embodiments can be obtained. That is, the sealing membercan be drawn at the same speed all over. Further, since the writingstart portion or the writing end portion is sufficiently separated fromthe panel, the complex control can be eliminated. Accordingly, drawingtime can be markedly reduced to half to one-third of drawing time in therelated art. In addition, thickening of the sealing member toward theinside of the liquid crystal device in the junction portion of thesealing member can be solved.

<3> When the first side 58 a of the ring-shaped portion 58 and the firstsealing layer 59 a are the straight lines, and the second sealing layer59 b has the curved portion 59 c (FIG. 24C, Third Embodiment)

Table 7 shows the examination results of the ratio h1/w1 of the hollowdepth h1 and the width w1 of the sealing member, and the panel state forthe shapes of the first and sealing layers 59 a and 59 b in the thirdembodiment, when the width w1 of the sealing member after bonding isfixed to 0.5 mm, and the radius R1 of the curved portion 59 c and thedistance d1 between the central lines of the sealing members arechanged.

In Table 7, in a *1 portion, the ratio h1/w1 of the hollow depth h1 ofthe junction portion 59 and the width w1 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h1/w1 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d1/w1 exceeds 0.9, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 7, d1/w1 and R1/w1 of the boundary where reliabilitycan be ensured and the boundary where the convex occurs in the junctionportion are plotted to be substantially on straight lines, as shown inFIG. 41.

Next, Table 8 shows the examination results of the change of hollowdepth h1 and the panel state for the shapes of the first and sealinglayers 59 a and 59 b in the third embodiment, when the width w1 of thesealing member after bonding is fixed to 0.7 mm, and the radius of thecurved portion 59 c and the distance d2 between the central lines of thesealing members are changed.

In Table 8, in a *1 portion, the ratio h1/w1 of the hollow depth h1 ofthe junction portion 59 and the width w1 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h1/w1 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d1/w1 exceeds 0.85, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 8, when d1/w1 and R1/w1 of the boundary wherereliability can be ensured and the boundary where the convex occurs inthe junction portion are plotted to be substantially on straight lines,as shown in FIG. 42.

Here, in a case in which the width w1 of the sealing member is 0.5 mmand 0.7 mm, for the boundary where reliability can be ensured and theboundary where the convex occurs in the junction portion, on the samegraph, the boundaries of d1/w1 and R1/w1 (FIGS. 41 and 42) are plottedas shown in FIG. 43.

As shown in FIG. 43, when the width w1 of the sealing member afterbonding is 0.5 mm or 0.7 mm, the boundaries are on the same line.Therefore, even when w1 is out of the above-described range, theboundaries are on the line of FIG. 43.

From FIG. 43, it can be seen that the relationship of d1/w1 and R1/w1 isplotted to be on the same line, without depending on the width of thesealing member.

As such, in order to ensure reliability, without depending on the sizeof the sealing member, the following condition is satisfied.

(R1/w1)≦−2.0×(d1/w1)+3.0  Equation 39

Ideally, the following condition is to be satisfied.

(R1/w1)≦−1.7×(d1/w1)+2.0  Equation 40

Further, the convex (thickening) of the sealing member in the junctionportion is less than 20 percent for the width of the sealing member,which does not matter practically. However, in order to completelyeliminate the convex of the junction portion including the variation insize of the sealing member, ideally, it is preferable that the followingcondition is satisfied.

(R1/w1)≧−1.2×(d1/w1)+1.0  Equation 41

In addition, in order to prevent the sealing members from being notbrought into contact with each other and to prevent liquid crystal fromleaking due to the variation in size of the sealing member in thejunction portion, ideally, it is preferable that the following conditionis satisfied.

d1/w1≦0.8  Equation 42

As described above, by defining the shapes of the first and secondsealing layers 59 a and 59 b, the same effects as those in theabove-described embodiments can be obtained. That is, the sealing membercan be drawn at the same speed all over. Further, since the writingstart portion or the writing end portion is sufficiently separated fromthe panel, the complex control can be eliminated. Accordingly, drawingtime can be markedly reduced to half to one-third of drawing time in therelated art. In addition, thickening of the sealing member toward theinside of the liquid crystal device in the junction portion of thesealing member can be solved.

<4> When the first side 58 a of the ring-shaped portion 58 and the firstsealing layer 59 a are the straight lines, and the second sealing layer59 b has the inclined portion 59 d (FIG. 25, Fourth Embodiment)

Table 9 shows the examination results of the ratio h1/w1 of the hollowdepth h1 and the width w1 of the sealing member, and the panel state forthe shapes of the first and sealing layers 59 a and 59 b in the fourthembodiment, when the width w1 of the sealing member after bonding isfixed to 0.5 mm, and the chamfered amount c1 of the inclined portion 59d and the distance d1 between the central lines of the sealing membersare changed.

In Table 9, in a *1 portion, the ratio h1/w1 of the hollow depth h1 ofthe junction portion 59 and the width w1 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h1/w1 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d1/w1 exceeds 0.9, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

Further, in Table 9, d1/w1 and c1/w1 of the boundary where reliabilitycan be ensured and the boundary where the convex occurs in the junctionportion are plotted to be substantially on straight lines, as shown inFIG. 44.

Next, Table 10 shows the examination results of the change of the hollowdepth h1 and the panel state for the shapes of the first and sealinglayers 59 a and 59 b in the fourth embodiment, when the width w1 of thesealing member after bonding is fixed to 0.7 mm, and the chamferedamount c1 of the inclined portion 59 d and the distance d1 between thecentral lines of the sealing members are changed.

In Table 10, in a *1 portion, the ratio h1/w1 of the hollow depth h1 ofthe junction portion 59 and the width w1 of the sealing member is equalto or less than 1.0 and, in this range, reliability of the panel can beensured. Further, a *2 portion does not matter practically in thejunction portion 59, but, in this range, the sealing member is notindented, but is slightly swelled. Further, in a *3 portion, h1/w1 islarger than 0.1 and equal to or less then 0.5, which is an ideal range.In a portion where d1/w1 exceeds 0.85, the sealing members were notbrought into contact with each other due to the variation in size of thesealing member or the like (FIG. 34), leakage of liquid crystal or thelike occurred.

In addition, in Table 10, when d1/w1 and c1/w1 of the boundary wherereliability can be ensured and the boundary where the convex occurs inthe junction portion are plotted to be substantially on straight lines,as shown in FIG. 45.

Here, in a case in which the width w1 of the sealing member is 0.5 mmand 0.7 mm, for the boundary where reliability can be ensured and theboundary where the convex occurs in the junction portion, on the samegraph, the boundaries of d1/w1 and c1/w1 (FIGS. 44 and 45) are plottedas shown in FIG. 46.

As shown in FIG. 46, when the width w1 of the sealing member afterbonding is 0.5 mm or 0.7 mm, the boundaries are on the same line.Therefore, even when w1 is out of the above-described range, theboundaries are on the line of FIG. 46.

From FIG. 46, it can be seen that the relationship of d1/w1 and c1/w1 isplotted to be on the same line, without depending on the width of thesealing member.

As such, in order to ensure reliability, without depending on the sizeof the sealing member, the following condition is satisfied.

(c1/w1)≦−0.5×(d1/w1)+1.2  Equation 43

Ideally, the following condition is to be satisfied.

(c1/w1)≦−0.5×(d1/w1)+0.7  Equation 44

Further, the convex (thickening) of the sealing member in the junctionportion is less than 20 percent for the width of the sealing member,which does not matter practically. However, in order to completelyeliminate the convex of the junction portion including the variation insize of the sealing member, ideally, it is preferable that the followingcondition is satisfied.

(c1/w1)≧−0.5×(d1/w1)+0.3  Equation 45

In addition, in order to prevent the sealing members from being notbrought into contact with each other and to prevent liquid crystal fromleaking due to the variation in size of the sealing member in thejunction portion, ideally, it is preferable that the following conditionis satisfied.

d1/w1≦0.8  Equation 46

As described above, by defining the shapes of the first and secondsealing layers 59 a and 59 b, the same effects as those in theabove-described embodiments can be obtained. That is, the sealing membercan be drawn at the same speed all over. Further, since the writingstart portion or the writing end portion is sufficiently separated fromthe panel, the complex control can be eliminated. Accordingly, drawingtime can be markedly reduced to half to one-third of drawing time in therelated art. In addition, thickening of the sealing member toward theinside of the liquid crystal device in the junction portion of thesealing member can be solved.

Electronic Apparatus

The specified examples of an electronic apparatus according to theembodiment of the invention will be described.

FIG. 47A is a perspective view showing an example of a cellular phone.In FIG. 47A, reference numeral 700 denotes a cellular phone main body,and reference numeral 701 denotes a liquid crystal display unit havingthe liquid crystal device according to any one of the embodiments.

FIG. 47B is a perspective view showing an example of a portableinformation processing apparatus, such as a word processor, a personalcomputer, or the like. In FIG. 47B, reference numeral 800 denotes aninformation processing apparatus, reference numeral 801 denotes an inputunit, such as a keyboard or the like, reference numeral 803 denotes aninformation processing apparatus main body, and reference numeral 802denotes a liquid crystal display unit having the liquid crystal deviceaccording to any one of the embodiments.

FIG. 47C is a perspective view showing an example of a wristwatch-typeelectronic apparatus. In FIG. 47C, reference numeral 900 denotes a watchmain body, and reference numeral 901 denotes a liquid crystal displayunit having the liquid crystal device according to any one of theembodiments.

The electronic apparatuses shown in FIGS. 47A to 47C have the liquidcrystal device according to any one of the embodiments. Therefore, anelectronic apparatus including a display unit, which has superiorreliability and performs high-quality display, is obtained.

What is claimed is:
 1. A display device, comprising: a thin filmtransistor panel having a first substrate and a second substrateopposite the first substrate, the first substrate having a pixel regioncontaining a plurality of pixel electrodes and a plurality of thin filmtransistors on a first surface facing the second substrate; a terminalregion on the first surface of the first substrate and projecting beyonda peripheral edge of the second substrate in a plan view; a commonelectrode disposed on the second substrate opposite at least one of theplurality of pixel electrodes; a seal member bonding the first substrateto the second substrate, the seal member uninterruptedly extendingaround a periphery of the pixel region; at least one wire disposed onthe first substrate and extending across the seal member; and a commontransfer section disposed coinciding with a part of the seal member on aside of the first substrate opposite the terminal region and connectingthe at least one wire on the first substrate with the common electrodeon the second substrate.
 2. The display device according to claim 1,wherein the common transfer section is one of a plurality of commontransfer sections respectively disposed on a plurality of areas of theside of the first substrate opposite the terminal region.
 3. The displaydevice according to claim 2, wherein all of the plurality of commontransfer sections connect to a single common electrode.
 4. The displaydevice according to claim 2, wherein the plurality of common transfersections is respectively disposed separately on the side of the firstsubstrate opposite the terminal region, and each of the plurality ofcommon transfer sections supplies a common electric potential to thecommon electrode on the second substrate.
 5. The display deviceaccording to claim 1, wherein the common transfer section is one of aplurality of common transfer sections respectively disposed on aplurality of areas of the side of the first substrate opposite theterminal region and sides of the first substrate adjacent to the sideopposite the terminal region.
 6. The display device according to claim5, wherein the plurality of common transfer sections is respectivelydisposed separately on the side of the first substrate opposite theterminal region and the adjacent sides, and each of the plurality ofcommon transfer sections supplies a common electric potential to thecommon electrode on the second substrate.
 7. The display deviceaccording to claim 1, wherein the at least one wire extends across theseal member without passing through the common transfer section.
 8. Thedisplay device according to claim 1, wherein the seal member on the sideof the substrate opposite the terminal region extends on the commontransfer section.
 9. The display device according to claim 8, wherein aplurality of conductive particles are disseminated within a part of theseal member extending along the side of the first substrate opposite theterminal region, and the common transfer section is connected to thecommon electrode on the second substrate through the plurality ofconductive particles in the seal member.
 10. A display device,comprising: a thin film transistor panel having a first substrate and asecond substrate opposite the first substrate, the first substratehaving a pixel region containing a plurality of pixel electrodes and aplurality of thin film transistors on a first surface facing the secondsubstrate; a terminal region on the first surface of the first substrateand projecting beyond a peripheral edge of the second substrate in aplan view; a common electrode disposed on the second substrate oppositeat least one of the plurality of pixel electrodes; a seal member bondingthe first substrate to the second substrate, the seal memberuninterruptedly extending around a periphery of the pixel region; atleast one wire disposed on the first substrate and extending across theseal member; and a common transfer section disposed coinciding with apart of the seal member only on a side of the first substrate oppositethe terminal region and connecting the at least one wire on the firstsubstrate with the common electrode on the second substrate.
 11. Thedisplay device according to claim 10, wherein the common transfersection is one of a plurality of common transfer sections respectivelydisposed on a plurality of areas of the side of the first substrateopposite the terminal region.
 12. The display device according to claim11, wherein all of the plurality of common transfer sections connect toa single common electrode.
 13. The display device according to claim 10,wherein a plurality of conductive particles are disseminated within apart of the seal member extending along the side of the first substrateopposite the terminal region, the common transfer section is connectedto the common electrode on the second substrate through the plurality ofconductive particles in the seal member, and the at least one wireextends across the seal member without passing through the commontransfer section.
 14. A display device, comprising: a thin filmtransistor panel having a substrate and a counter substrate opposite thesubstrate, the substrate having a pixel region containing a plurality ofpixel electrodes and a plurality of thin film transistors on a firstsurface facing the counter substrate; a terminal region on the firstsurface of the substrate and projecting beyond a peripheral edge of thecounter substrate in a plan view; a common electrode disposed on thecounter substrate opposite at least one of the plurality of pixelelectrodes; a seal member bonding the substrate to the countersubstrate, the seal member uninterruptedly extending around a peripheryof the pixel region; and at least one wire disposed on the substrate andextending across the seal member, wherein a plurality of conductiveparticles are disseminated within a part of the seal member extendingsuccessively along a side of the substrate opposite the terminal regionand portions of sides adjacent to the side opposite the terminal region,at least three common transfer sections are disposed coinciding with thepart of the seal member including the plurality of conductive particles,the at least three common transfer sections connecting the at least onewire on the substrate with the common electrode on the countersubstrate, and the at least three common transfer sections are connectedto the common electrode on the counter substrate through the pluralityof conductive particles in the seal member.
 15. The display deviceaccording to claim 14, wherein the at least one wire is one of aplurality of wires disposed on the substrate, each of the plurality ofwires extending across the seal member.
 16. The display device accordingto claim 15, wherein the plurality of wires is respectively connected toa plurality of thin film transistors.
 17. The display device accordingto claim 16, wherein each of the plurality of wires extends from atleast one of the plurality of thin film transistors to the terminalregion across the seal member without directly connecting to the atleast three common transfer sections.
 18. The display device accordingto claim 14, wherein the at least one wire is connected to at least onethin film transistor.
 19. The display device according to claim 14,wherein the at least one wire is provided in the pixel region.
 20. Thedisplay device according to claim 14, wherein the at least one wireextends across the seal member without connecting to any of the at leastthree common transfer sections.